Laser machining method and laser machining apparatus

US9919383B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9919383-B2
Application numberUS-201415515464-A
CountryUS
Kind codeB2
Filing dateOct 17, 2014
Priority dateOct 17, 2014
Publication dateMar 20, 2018
Grant dateMar 20, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A laser machining method includes a first piercing process of forming a non-through piercing hole extending from a top surface to a central portion of a workpiece; a workpiece cooling process; a second piercing process of making the piercing hole pierce to a bottom surface of the workpiece; and a workpiece cutting process. The second piercing process includes performing piercing by irradiating the workpiece with a laser beam while changing the output of the laser beam from a second output value to a third output value, which is smaller than the first output value and larger than the second output value, the focal position from a first in-focus position to a second in-focus position having a larger in-focus amount than the first in-focus position, and the depth of focus from a second depth deeper than a first depth to a third depth deeper than the second depth.

First claim

Opening claim text (preview).

The invention claimed is: 1. A laser machining method of forming a piercing hole by irradiating a workpiece with a laser beam and cutting the workpiece starting from the piercing hole, which is a machining start point, the method comprising: a first piercing process of forming the piercing hole that is a non-through hole extending from a top surface to a central portion of the workpiece; a cooling process of cooling the workpiece; a second piercing process of making the piercing hole pierce through to a bottom surface of the workpiece; and a cutting process of cutting the workpiece, wherein the first piercing process includes performing piercing by irradiating the workpiece with the laser beam while setting an output of the laser beam at a first output value, setting a focal position of the laser beam at a defocus position, setting a depth of focus of the laser beam at a first depth, and setting a side gas blow pressure, which is a pressure of a side gas fed to a machining point, at a first pressure value, and the second piercing process includes performing piercing by irradiating the workpiece with the laser beam while changing the output of the laser beam to a third output value, which is smaller than the first output value and larger than a second output value, changing the focal position to a second in-focus position, which has a larger in-focus amount than a first in-focus position, and changing the depth of focus to a third depth, which is deeper than a second depth, from a state in which the output of the laser beam is set at the second output value, which is smaller than the first output value, in which the focal position is set at the first in-focus position, in which the depth of focus is set at the second depth, which is deeper than the first depth, and in which the side gas blow pressure is set at a second pressure value, which is lower than the first pressure value. 2. The laser machining method according to claim 1 , wherein the first piercing process includes setting a machining head height at a first height, the machining head height being a height of a machining head irradiating the workpiece with the laser beam from the workpiece, the cooling process includes maintaining the machining head height at the first height, and the second piercing process includes setting the machining head height at a second height, which is lower than the first height. 3. The laser machining method according to claim 2 , wherein, during the cooling process, the focal position is changed from the defocus position to the first in-focus position and the depth of focus is changed from the first depth to the second depth. 4. The laser machining method according to claim 1 , wherein the second piercing process includes changing the output, the focal position, and the depth of focus of the laser beam stepwise. 5. The laser machining method according to claim 1 , further comprising: measuring a temperature of the workpiece prior to each of the first piercing process, the second piercing process, and the cutting process and adjusting, on a basis of a measured temperature of the workpiece, the output, the focal position, and the depth of focus of the laser beam, and the side gas blow pressure during the first piercing process, the second piercing process, and the cutting process with a machining parameter adjustment function so as to perform machining. 6. The laser machining method according to claim 5 , further comprising: detecting an occurrence of self-burning during the first piercing process and the second piercing process and a piercing time required for the piercing hole to be pierced from a start of machining; correcting the machining parameter adjustment function so as to have a bias causing an increase in time when an occurrence of the self-burning is detected; and correcting the machining parameter adjustment function so as to have a bias causing a reduction in time when an occurrence of the self-burning is not detected and the piercing time is longer than a previous time. 7. The laser machining method according to claim 5 , further comprising jetting cooling fluid against the workpiece prior to each of the first piercing process, the second piercing process, and the cutting process. 8. A laser machining apparatus that forms a piercing hole by irradiating a workpiece with a laser beam and cuts the workpiece starting from the piercing hole, which is a machining start point, the apparatus comprising: a laser oscillator to oscillate the laser beam; a curvature variable optical component to change a depth of focus of the laser beam; a machining head to be able to have a varied machining head height, which is a height from the workpiece, and to irradiate the workpiece with the laser beam; a lens to change a focal position of the laser beam emitted from the curvature variable optical component independently of the machining head height, the lens being provided inside the machining head; a side gas feeder to be able to change a side gas blow pressure, which is a pressure of a side gas jetting out to a machining point on the workpiece; and a controller to control an output, the depth of focus, and the focal position of the laser beam, the machining head height, and the side gas blow pressure, wherein the controller performs: a first piercing process of forming the piercing hole that is a non-through hole extending from a top surface to a central portion of the workpiece by performing piercing by irradiating the workpiece with the laser beam while setting the output of the laser beam at a first output value, setting the focal position at a defocus position, setting the depth of focus at a first depth, and setting the side gas blow pressure at a first pressure value; and a second piercing process of making the piercing hole pierce through to a bottom surface of the workpiece by performing piercing while changing the output of the laser beam to a third output value, which is smaller than the first output value and larger than a second output value, changing the focal position to a second in-focus position, which has a larger in-focus amount than a first in-focus position, and changing the depth of focus to a third depth, which is deeper than a second depth, from a state in which the output of the laser beam is set at the second output value, which is smaller than the first output value, in which the focal position is set at the first in-focus position, in which the depth of focus is set at the second depth, which is deeper than the first depth, and in which the side gas blow pressure is set at a second pressure value, which is lower than the first pressure value. 9. The laser machining apparatus according to claim 8 , further comprising a temperature sensor to measure a temperature of the workpiece, wherein the controller uses the temperature sensor to measure a temperature of the workpiece prior to the first piercing process, the second piercing process, and a cutting process of performing the cutting and adjusts, on a basis of a measured temperature of the workpiece, the output, the focal position, and the depth of focus of the laser beam, and the side gas blow pressure during the first piercing process, the second piercing process, and the cutting process with a machining parameter adjustment function so as to perform laser machining. 10. The laser machining apparatus according to claim 9 , further comprising an optical sensor to detect an occurrence of self-burning during the first piercing process and the second piercing process and a piercing time required for the piercing hole to be pierced from a start of machining, wherein the controller corrects the machining parameter adjustment function so as to ha

Assignees

Inventors

Classifications

  • by beam condensation on the workpiece, e.g. for focusing · CPC title

  • using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor (B23K26/12 takes precedence) · CPC title

  • Automatically aligning the laser beam · CPC title

  • Operations & Transport · mapped topic

  • by means of optical elements, e.g. lenses, mirrors or prisms · CPC title

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What does patent US9919383B2 cover?
A laser machining method includes a first piercing process of forming a non-through piercing hole extending from a top surface to a central portion of a workpiece; a workpiece cooling process; a second piercing process of making the piercing hole pierce to a bottom surface of the workpiece; and a workpiece cutting process. The second piercing process includes performing piercing by irradiating …
Who is the assignee on this patent?
Mitsubishi Electric Corp
What technology area does this patent fall under?
Primary CPC classification B23K26/38. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Mar 20 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).