Lean optimized additive manufacturing process
US-2020306881-A1 · Oct 1, 2020 · US
using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece (using a mask on the workpiece B23K26/0661)
using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece (using a mask on the workpiece B23K26/0661) · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K26/009 |
| Official title | {using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece (using a mask on the workpiece B23K26/0661)} |
| Display label | using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece (using a mask on the workpiece B23K26/0661) |
| Total patents | 149 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 7 |
| 2016 | 10 |
| 2017 | 13 |
| 2018 | 11 |
| 2019 | 18 |
| 2020 | 20 |
| 2021 | 11 |
| 2022 | 26 |
| 2023 | 7 |
| 2024 | 11 |
| 2025 | 13 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Laser peening device and laser peening method
US-2019344383-A1 · Nov 14, 2019 · US
Reflective detection method and reflectance detection apparatus
US-10471536-B2 · Nov 12, 2019 · US
Methods for forming holes in substrates
US-2019321921-A1 · Oct 24, 2019 · US
Methods for laser processing rough transparent workpieces using pulsed laser beam focal lines and a fluid film
US-2019300418-A1 · Oct 3, 2019 · US
Electrostatic chuck table using method
US-10410901-B2 · Sep 10, 2019 · US
Backside stealth dicing through tape followed by front side laser ablation dicing process
US-10373857-B2 · Aug 6, 2019 · US
Liquid-assisted laser micromachining of transparent dielectrics
US-2019233321-A1 · Aug 1, 2019 · US
Laser processing apparatus and laser processing method
US-2019232423-A1 · Aug 1, 2019 · US
Liquid-assisted laser micromachining systems and methods for processing transparent dielectrics and optical fiber components using same
US-2019232435-A1 · Aug 1, 2019 · US
Laser processing method
US-2019232431-A1 · Aug 1, 2019 · US
Wafer processing method
US-2019164832-A1 · May 30, 2019 · US
Pressure-sensitive adhesive film
US-10293435-B2 · May 21, 2019 · US
Method using a laser for welding between two metallic materials or for sintering of powder(s), application for making bipolar plates for pem fuel cells
US-2019134744-A1 · May 9, 2019 · US
Backside Stealth Dicing Through Tape Followed by Front Side Laser Ablation Dicing Process
US-2019131160-A1 · May 2, 2019 · US
Laser processing apparatus
US-2019118303-A1 · Apr 25, 2019 · US
Component manufacturing method and component
US-2019071749-A1 · Mar 7, 2019 · US
Method of laser induced marking of an article
US-2019062896-A1 · Feb 28, 2019 · US
Method and apparatus for marking an article
US-10213871-B2 · Feb 26, 2019 · US
Method of laser induced marking of an article
US-10145002-B2 · Dec 4, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K26/009?
- CPC B23K26/009 is the Cooperative Patent Classification code for “using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece (using a mask on the workpiece B23K26/0661).”
- How many patents are filed under CPC B23K26/009 (using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece (using a mask on the workpiece B23K26/0661))?
- Our database includes 149 publications tagged with this CPC code.
- Is patent activity under CPC B23K26/009 growing?
- Publication counts under this code: 11 in 2024 vs 13 in 2025 (latest complete years).