Electrostatic chuck table using method

Patent metadata

Field	Value
Publication number	US-10410901-B2
Application number	US-201815905126-A
Country	US
Kind code	B2
Filing date	Feb 26, 2018
Priority date	Feb 27, 2017
Publication date	Sep 10, 2019
Grant date	Sep 10, 2019

Abstract

An electrostatic chuck table includes a plate-shaped base portion capable of transmitting a laser beam to be applied to a workpiece and an electrostatic attraction electrode portion capable of transmitting the laser beam. The laser beam has a transmission wavelength to the workpiece. The base portion has a first surface and a second surface opposite to the first surface. The electrode portion is formed on the first surface of the base portion. A method for using the electrostatic chuck table includes a workpiece holding step of applying a voltage to the electrode portion formed on the first surface to thereby electrostatically hold the workpiece on the second surface, and a modified layer forming step of applying the laser beam through the first surface to a predetermined position inside the workpiece held on the second surface to thereby form a modified layer inside the workpiece.

First claim

What is claimed is:

1. An electrostatic chuck table using method for using an electrostatic chuck table including:
a plate-shaped base portion capable of transmitting a laser beam therethough to a workpiece, said laser beam having a transmission wavelength with respect to said workpiece, said base portion having a first surface and a second surface opposite to said first surface, and
an electrostatic attraction electrode portion capable of transmitting said laser beam therethrough, said electrode portion being formed on said first surface of said base portion,
said electrostatic chuck table using method comprising:
a workpiece holding step of applying a voltage to said electrode portion formed on said first surface to thereby electrostatically hold said workpiece on said second surface; and
a modified layer forming step of applying said laser beam through said first surface to a predetermined position inside said workpiece held on said second surface to thereby form a modified layer inside said workpiece while said workpiece is electrostatically held on said second surface.

2. The electrostatic chuck table using method according to claim 1 , wherein the transmission wavelength of said laser beam is set in the range of 500 to 1400 nm.

3. The electrostatic chuck table using method according to claim 1 , wherein said workpiece includes a wafer having a front side where MEMS devices are formed and a back side to be held on said second surface of said electrostatic chuck table.

4. The electrostatic chuck table using method according to claim 1 , wherein during the modified layer forming step, the laser beam passes through said base portion of said electrostatic chuck table before passing into said workpiece.

5. The electrostatic chuck table using method according to claim 1 , wherein said workpiece includes a front side with a plurality of devices thereon and a back side that is opposite of the front side, and further wherein the back side of the workpiece faces the second surface of the base portion of the electrostatic chuck table during the modified layer forming step.

Assignees

• Disco Corp

Inventors

• Furuta Kenji
• Sato Yuriko
• Matsuzaki Sakae

Classifications

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title

• B23K26/037

  by pressing on the workpiece, e.g. using a pressing roller foot · CPC title

• B23K26/009

  using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece (using a mask on the workpiece B23K26/0661) · CPC title

• B23K2103/56

  being semiconducting · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title