Solder reflow apparatus and method of manufacturing an electronic device
US-12519077-B2 · Jan 6, 2026 · US
Vapour-condensation soldering
Vapour-condensation soldering · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K1/015 |
| Official title | Vapour-condensation soldering |
| Display label | Vapour-condensation soldering |
| Total patents | 27 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2016 | 2 |
| 2017 | 2 |
| 2018 | 1 |
| 2019 | 1 |
| 2020 | 5 |
| 2021 | 1 |
| 2022 | 2 |
| 2023 | 1 |
| 2024 | 5 |
| 2025 | 6 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Solder reflow apparatus and method of manufacturing electronic device
US-12420348-B2 · Sep 23, 2025 · US
Solder reflow apparatus
US-12334468-B2 · Jun 17, 2025 · US
Solder reflow apparatus and method of manufacturing an electronic device
US-2025167166-A1 · May 22, 2025 · US
Solder reflow apparatus and method of manufacturing an electronic device
US-12237297-B2 · Feb 25, 2025 · US
Solder reflow apparatus and method of manufacturing an electronic device
US-2025046750-A1 · Feb 6, 2025 · US
Solder reflow apparatus and method of manufacturing electronic device
US-2025033132-A1 · Jan 30, 2025 · US
Solder reflow apparatus and method of manufacturing an electronic device
US-12154882-B2 · Nov 26, 2024 · US
Solder reflow apparatus and method of manufacturing electronic device
US-2024293884-A1 · Sep 5, 2024 · US
Solder reflow apparatus
US-2024113067-A1 · Apr 4, 2024 · US
Solder reflow apparatus and method of manufacturing an electronic device
US-2024047411-A1 · Feb 8, 2024 · US
Solder reflow apparatus and method of manufacturing an electronic device
US-2024047410-A1 · Feb 8, 2024 · US
Method of diffusion bonding utilizing vapor deposition
US-11612947-B2 · Mar 28, 2023 · US
Method for formation of patterned solder mask
US-11477894-B2 · Oct 18, 2022 · US
Gas phase type heating method and gas phase type heating device
US-11262129-B2 · Mar 1, 2022 · US
Method of diffusion bonding utilizing vapor deposition
US-2021205911-A1 · Jul 8, 2021 · US
Vapor-phase type heating method and vapor-phase type heating apparatus
US-10875114-B2 · Dec 29, 2020 · US
Solder mask
US-2020288580-A1 · Sep 10, 2020 · US
Hydrofluoroepoxide containing compositions and methods for using same
US-2020255714-A1 · Aug 13, 2020 · US
Vapor-phase type heating method and vapor-phase type heating apparatus
US-10717143-B2 · Jul 21, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K1/015?
- CPC B23K1/015 is the Cooperative Patent Classification code for “Vapour-condensation soldering.”
- How many patents are filed under CPC B23K1/015 (Vapour-condensation soldering)?
- Our database includes 27 publications tagged with this CPC code.
- Is patent activity under CPC B23K1/015 growing?
- Publication counts under this code: 5 in 2024 vs 6 in 2025 (latest complete years).