Solder reflow apparatus

Patent metadata

Field	Value
Publication number	US-12334468-B2
Application number	US-202318136416-A
Country	US
Kind code	B2
Filing date	Apr 19, 2023
Priority date	Oct 4, 2022
Publication date	Jun 17, 2025
Grant date	Jun 17, 2025

Abstract

A solder reflow apparatus includes: a reflow chamber configured to receive a heat transfer fluid, wherein the heat transfer fluid transfers heat to a solder for mounting an electronic part on a substrate; a heater configured to heat the heat transfer fluid in the reflow chamber; a stage arranged in the reflow chamber to support the substrate; and a jig disposed on the electronic part and fixing the electronic part.

First claim

What is claimed is:

1. A solder reflow apparatus comprising:
a reflow chamber configured to receive a heat transfer fluid, wherein the heat transfer fluid transfers heat to a solder for mounting an electronic part on a substrate;
a heater configured to heat the heat transfer fluid in the reflow chamber;
a stage arranged in the reflow chamber to support the substrate; and
a jig disposed on the electronic part and fixing the electronic part,
wherein a lower surface of the jig includes a slant surface.

2. The solder reflow apparatus of claim 1 , wherein the jig has a width larger than a width of the electronic part.

3. The solder reflow apparatus of claim 2 , wherein the jig comprises an absorption layer arranged on the lower surface of the jig to absorb a liquid generated by a condensation of the heat transfer fluid.

4. The solder reflow apparatus of claim 2 , wherein the jig comprises a porous layer arranged on the lower surface of the jig, wherein a liquid, which is generated by a condensation of the heat transfer fluid, travels through the porous layer.

5. The solder reflow apparatus of claim 4 , wherein the porous layer comprises ceramic.

6. The solder reflow apparatus of claim 2 , wherein the slant surface is downwardly inclined from a central portion of the lower surface of the jig to an edge portion of the lower surface of the jig to induce a liquid, which is generated by a condensation of the heat transfer fluid, to move from the central portion to the edge portion in the jig.

7. The solder reflow apparatus of claim 1 , further comprising a lifter configured to lift the stage.

8. The solder reflow apparatus of claim 1 , wherein the substrate comprises a package substrate, and the electronic part comprises a semiconductor chip.

9. A solder reflow apparatus comprising:
a reflow chamber configured to receive a heat transfer fluid, wherein the heat transfer fluid transfers heat to a solder for mounting a semiconductor chip on a package substrate;
a heater configured to heat the heat transfer fluid in the reflow chamber;
a stage, wherein the package substrate is disposed on the stage; and
a jig contacting an upper surface of the semiconductor chip, and including a vacuum line for fixing the semiconductor chip by using a vacuum, wherein the jig has a width larger than a width of the semiconductor chip,
wherein a lower surface of the jig includes a slant surface.

10. The solder reflow apparatus of claim 9 , wherein the jig comprises an absorption layer arranged on the lower surface of the jig to absorb a liquid generated by a condensation of the heat transfer fluid.

11. The solder reflow apparatus of claim 9 , wherein the jig comprises a porous layer arranged on the lower surface of the jig, wherein a liquid, which is generated by a condensation of the heat transfer fluid, travels through the porous layer.

12. The solder reflow apparatus of claim 9 , wherein the slant surface is downwardly inclined from a central portion of the lower surface of the jig to an edge portion of the lower surface of the jig to induce a liquid, which is generated by a condensation of the heat transfer fluid, to move from the central portion to the edge portion in the jig.

13. The solder reflow apparatus of claim 9 , further comprising a lifter configured to lift the stage.

14. A solder reflow apparatus comprising:
a reflow chamber configured to receive a heat transfer fluid, wherein the heat transfer fluid transfers heat to a solder for mounting a semiconductor chip on a package substrate;
a heater configured to heat the heat transfer fluid in the reflow chamber;
a stage arranged in the reflow chamber and disposed below the package substrate;
a lifter configured to move the stage; and
a jig contacting an upper surface of the semiconductor chip, and including a vacuum line for fixing the semiconductor chip by using vacuum to prevent a slip of the semiconductor chip, which is caused by a liquid generated by a condensation of the heat transfer fluid,
wherein the jig comprises a slant surface downwardly inclined from a central portion of a lower surface of the jig to an edge portion of the lower surface of the jig to induce the liquid to move from the central portion to the edge portion in the jig.

15. The solder reflow apparatus of claim 14 , wherein the jig comprises an absorption layer arranged on the lower surface of the jig to absorb the liquid.

16. The solder reflow apparatus of claim 14 , wherein the jig comprises a porous layer arranged on the lower surface of the jig, and including a plurality of holes.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Youngja

Classifications

• H10W72/072

  of bump connectors · CPC title

• H10W72/0711

  Apparatus therefor · CPC title

• H10W72/20 Primary

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H10W72/07173

  Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title

• H10W72/07163

  Means for mechanical processing, e.g. for planarising, pressing, stamping or drilling · CPC title