Method for attaching a porous metal layer to a metal substrate

US9656358B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9656358-B2
Application numberUS-201313862786-A
CountryUS
Kind codeB2
Filing dateApr 15, 2013
Priority dateJun 18, 2002
Publication dateMay 23, 2017
Grant dateMay 23, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, comprises providing a solid metal substrate; providing a porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous metal structure is disposed against the substrate, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous structure and the substrate; and removing mass from the substrate after the porous structure is bonded to the substrate, thereby finish processing the assembly.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of forming an implantable orthopedic construct that includes a porous surface layer, comprising: providing or obtaining an initial version of an orthopedic construct that includes an underlying metal substrate of a first mass metallurgically bonded to a porous metal surface layer by applying clamping pressure to and heating the underlying metal substrate of the first mass and the porous surface layer; and reshaping the initial version of the orthopedic construct into a subsequent version of the orthopedic construct which includes removing mass from the underlying metal substrate of the first mass to form an underlying metal substrate of a second mass, wherein the underlying metal substrate of the first mass is significantly more massive than the underlying metal substrate of the second mass such that the underlying metal substrate of the first mass will exhibit greater thermal expansion when heated than would the underlying metal substrate of the second mass. 2. The method of claim 1 , wherein the implantable orthopedic construct is a femoral knee component. 3. The method of claim 1 , wherein the implantable orthopedic construct is a femoral hip component. 4. The method of claim 1 , wherein the implantable orthopedic construct is an acetabular cup. 5. The method of claim 4 , wherein the underlying metal substrate of the first mass is an unfinished acetabular cup substrate of a hemispherical shape. 6. The method of claim 5 , wherein removing mass from the underlying metal substrate of the first mass includes hollowing out the hemispherical shape. 7. The method of claim 1 , wherein the underlying metal substrate comprises a cobalt alloy or a titanium alloy. 8. The method of claim 7 , wherein the titanium alloy is a Ti-6Al-4V alloy. 9. The method of claim 1 , wherein the metallurgical bonds include bonding a sintered metal powder to the underlying metal substrate.

Assignees

Inventors

Classifications

  • Coating made of titanium or of Ti-based alloys · CPC title

  • Porous materials, {e.g. foams or sponges} · CPC title

  • Sizing mating parts during final positional association · CPC title

  • Titanium or titanium-based alloys, e.g. Ti-Ni alloys · CPC title

  • B23P23/00Primary

    Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass (if the particular kinds of operation are not essential B23Q37/00 - B23Q41/00; {working by laser beam combined with other working of metal B23K26/0093}) · CPC title

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Frequently asked questions

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What does patent US9656358B2 cover?
A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, comprises providing a solid metal substrate; providing a porous metal structure; contouring a surface of the porous metal structure;…
Who is the assignee on this patent?
Zimmer Inc
What technology area does this patent fall under?
Primary CPC classification B23P23/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue May 23 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).