Hollow fiber membrane module
US-2026091358-A1 · Apr 2, 2026 · US
Wafer type modules or flat-surface type modules · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B01D63/026 |
| Official title | {Wafer type modules or flat-surface type modules} |
| Display label | Wafer type modules or flat-surface type modules |
| Total patents | 50 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 7 |
| 2016 | 8 |
| 2017 | 6 |
| 2018 | 5 |
| 2019 | 9 |
| 2020 | 2 |
| 2021 | 3 |
| 2022 | 4 |
| 2023 | 1 |
| 2024 | 2 |
| 2025 | 2 |
| 2026 | 1 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-2026091358-A1 · Apr 2, 2026 · US
US-2025281729-A1 · Sep 11, 2025 · US
US-12390770-B2 · Aug 19, 2025 · US
US-12064543-B2 · Aug 20, 2024 · US
US-2024091712-A1 · Mar 21, 2024 · US
US-2023338899-A1 · Oct 26, 2023 · US
US-11471575-B2 · Oct 18, 2022 · US
US-11352270-B2 · Jun 7, 2022 · US
US-11278652-B2 · Mar 22, 2022 · US
US-11224685-B2 · Jan 18, 2022 · US
US-11000808-B2 · May 11, 2021 · US
US-2021129083-A1 · May 6, 2021 · US
US-2021128813-A1 · May 6, 2021 · US
US-2020109070-A1 · Apr 9, 2020 · US
US-2020094191-A1 · Mar 26, 2020 · US
US-10507430-B2 · Dec 17, 2019 · US
US-2019336668-A1 · Nov 7, 2019 · US
US-10377650-B2 · Aug 13, 2019 · US
US-2019216999-A1 · Jul 18, 2019 · US
US-2019201850-A1 · Jul 4, 2019 · US
Answers are generated from the same data shown on this page.