Wafer type modules or flat-surface type modules

Wafer type modules or flat-surface type modules · Cooperative Patent Classification (CPC)

Separating, mixing, shaping, printing, and transporting materials.

Related technology areas

Mapped technology topics for this CPC code.

CPC classification statistics
MetricValue
CPC codeB01D63/026
Official title{Wafer type modules or flat-surface type modules}
Display labelWafer type modules or flat-surface type modules
Total patents50

Filing trend

Year-over-year patent counts classified under this CPC code.

Filing activity over the last five years is declining.

Patents filed per year
YearPatents
20157
20168
20176
20185
20199
20202
20213
20224
20231
20242
20252
20261

Representative patents

Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.

Frequently asked questions

Answers are generated from the same data shown on this page.

What is CPC B01D63/026?
CPC B01D63/026 is the Cooperative Patent Classification code for “Wafer type modules or flat-surface type modules.”
How many patents are filed under CPC B01D63/026 (Wafer type modules or flat-surface type modules)?
Our database includes 50 publications tagged with this CPC code.
Is patent activity under CPC B01D63/026 growing?
Publication counts under this code: 2 in 2024 vs 2 in 2025 (latest complete years).