Particle removal method in semiconductor fabrication process
US-12568785-B2 · Mar 3, 2026 · US
by directing the gas through a wetted wire mesh or a perforated plate (B01D47/14 takes precedence) · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B01D47/028 |
| Official title | {by directing the gas through a wetted wire mesh or a perforated plate (B01D47/14 takes precedence)} |
| Display label | by directing the gas through a wetted wire mesh or a perforated plate (B01D47/14 takes precedence) |
| Total patents | 20 |
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 1 |
| 2017 | 2 |
| 2018 | 2 |
| 2020 | 2 |
| 2022 | 2 |
| 2023 | 2 |
| 2024 | 4 |
| 2025 | 1 |
| 2026 | 2 |
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
US-12568785-B2 · Mar 3, 2026 · US
US-2026060024-A1 · Feb 26, 2026 · US
US-12257543-B2 · Mar 25, 2025 · US
US-2024363329-A1 · Oct 31, 2024 · US
US-12062535-B2 · Aug 13, 2024 · US
US-2024149212-A1 · May 9, 2024 · US
US-2024120204-A1 · Apr 11, 2024 · US
US-11795850-B2 · Oct 24, 2023 · US
US-2023018029-A1 · Jan 19, 2023 · US
US-2022251991-A1 · Aug 11, 2022 · US
US-2022250000-A1 · Aug 11, 2022 · US
US-10737213-B2 · Aug 11, 2020 · US
US-10625197-B2 · Apr 21, 2020 · US
US-2018117519-A1 · May 3, 2018 · US
US-2018001254-A1 · Jan 4, 2018 · US
US-9566504-B2 · Feb 14, 2017 · US
US-2017028095-A1 · Feb 2, 2017 · US
US-9358490-B2 · Jun 7, 2016 · US
US-2015251132-A1 · Sep 10, 2015 · US
US-2015075385-A1 · Mar 19, 2015 · US