Particle removal method in semiconductor fabrication process

Patent metadata

Field	Value
Publication number	US-12062535-B2
Application number	US-202117377820-A
Country	US
Kind code	B2
Filing date	Jul 16, 2021
Priority date	Jul 16, 2021
Publication date	Aug 13, 2024
Grant date	Aug 13, 2024

Abstract

A system for processing a semiconductor wafer is provided. The system includes a processing tool. The system also includes gas handling housing having a gas inlet and a gas outlet. The system further includes an exhaust conduit fluidly communicating with the processing tool and the gas inlet of the gas handling housing. In addition, the system includes at least one first filtering assembly and at least one second filtering assembly. The first filtering assembly and the second filtering assembly are positioned in the gas handling housing and arranged in a series along a flowing path that extends from the gas inlet to the gas outlet of the gas handling housing. Each of the first filtering assembly and the second filtering assembly comprises a plurality of wire meshes stacked on top of another.

First claim

What is claimed is:

1. A system, comprising:
a processing tool;
a gas handling housing having a gas inlet and a gas outlet;
an exhaust conduit fluidly communicating with the processing tool and the gas inlet of the gas handling housing; and
at least one first filtering assembly and at least one second filtering assembly positioned in the gas handling housing and arranged in a series along a flowing path that extends from the gas inlet to the gas outlet of the gas handling housing, wherein each of the first filtering assembly and the second filtering assembly comprises a plurality of wire meshes stacked on top of another,
wherein the wire meshes of the first filtering assembly are arranged around a first longitudinal axis and stacked in a radial direction of the first filtering assembly that is perpendicular to the first longitudinal axis,
wherein each of the wire meshes comprises a plurality of three dimensional structures, and each of the three dimensional structures includes:
a plurality of first filaments extending in an X-axis direction, wherein in a Y-axis direction, every two adjacent first filaments are arranged in pairs, and the pairs of the first filaments are stacked in a Z-axis direction, wherein a distance between each pair of the first filaments decreases along the Z-axis direction; and
a plurality of second filaments extending in the Y-axis direction, wherein in the X-axis direction, every two adjacent second filaments are arranged in pairs, and the pairs of the second filaments are stacked in the Z-axis direction, wherein a distance between each pair of the second filaments decreases along the Z-axis direction.

2. The system as claimed in claim 1 , wherein the wire meshes of the second filtering assembly that are stacked are arranged around a second longitudinal axis, the first longitudinal axis extends in different directions than the second longitudinal axis.

3. The system as claimed in claim 1 , wherein the number of the first filtering assemblies and the number of the second filtering assemblies are plural, two of the first filtering assemblies are arranged parallel to another, and two of the second filtering assemblies are arranged parallel to another.

4. The system as claimed in claim 1 , wherein the wire meshes of the first filtering assembly that are stacked collectively form a tubular-shaped filtering structure, and the first filtering assembly comprises a plate covering an distal end of the tubular-shaped filtering structure, whereby an exhausting gas flowing into the first filtering assembly through a proximal end of the tubular-shaped filtering structure and leaves the first filtering assembly by passing through the wire meshes.

5. The system as claimed in claim 1 , further comprising a liquid spraying assembly positioned in the gas handling housing and configured to spray a mist over the first filtering assembly or the second filtering assembly.

6. The system as claimed in claim 1 , wherein a lateral surface is formed with a number of filaments that are arranged parallel to each other.

7. The system as claimed in claim 1 , wherein two of the wire meshes of the first filtering assembly are formed with filaments having different widths.

8. A system, comprising:
a processing tool;
a gas handling housing fluidly communicating with the processing tool;
a filtering assembly positioned in the gas handling housing and comprising a plurality of wire meshes, wherein the wire meshes are stacked on top of another; and
a liquid spraying member positioned in the gas handling housing and configured to spray a mist over the wire meshes,
wherein the wire meshes which are stacked collectively form a tubular-shaped filtering structure, and the liquid spraying member is surrounded by the tubular-shaped filtering structure,
wherein each of the wire meshes comprises a plurality of three dimensional structures, and each of the three dimensional structures includes:
a plurality of first filaments extending in an X-axis direction, wherein in a Y-axis direction, every two adjacent first filaments are arranged in pairs, and the pairs of the first filaments are stacked in a Z-axis direction, wherein a distance between each pair of the first filaments decreases along the Z-axis direction; and
a plurality of second filaments extending in the Y-axis direction, wherein in the X-axis direction, every two adjacent second filaments are arranged in pairs, and the pairs of the second filaments are stacked in the Z-axis direction, wherein a distance between each pair of the second filaments decreases along the Z-axis direction.

9. The system as claimed in claim 8 , wherein the mist sprayed by the liquid spraying member has a cylindrical cone pattern.

10. The system as claimed in claim 8 , wherein the liquid spraying member comprises a plurality of nozzles, and at least two of the nozzles are oriented in different directions.

11. The system as claimed in claim 8 , wherein a lateral surface is formed with a number of filaments that are arranged parallel to each other.

12. The system as claimed in claim 8 , wherein two of the wire meshes of the filtering assembly are formed with filaments having different widths.

13. The system as claimed in claim 8 , further comprising another filtering assembly, wherein the two filtering assemblies are arranged in a series in the gas handling housing.

14. The system as claimed in claim 1 , wherein
the plurality of first filaments, which extend in the X-axis direction, form two ladder-shaped lateral surfaces of the three dimensional structure in the Y-axis direction; and
the plurality of second filaments, which extend in the Y-axis direction, form two ladder-shaped lateral surfaces of the three dimensional structure in the X-axis direction.

15. The system as claimed in claim 14 , wherein the wire meshes comprises a first wire mesh and a second wire mesh, the size of through holes in the first wire meshes is greater than the size of through holes in the second wire meshes, the through holes in each of the first and second wire meshes are defined at intersections of the first filaments and the second filaments.

16. The system as claimed in claim 8 , wherein
the plurality of first filaments, which extend in the X-axis direction, form two ladder-shaped lateral surfaces of the three dimensional structure in the Y-axis direction; and
the plurality of second filaments, which extend in the Y-axis direction, form two ladder-shaped lateral surfaces of the three dimensional structure in the X-axis direction.

17. The system as claimed in claim 16 , wherein the wire meshes comprises a first wire mesh and a second wire mesh, the size of through holes in the first wire meshes is greater than the size of through holes in the second wire meshes, the through holes in each of the first and second wire meshes are defined at intersections of the first filaments and the second filaments.

18. A system, comprising:
a processing tool;
a gas handling housing fluidly communicating with the processing tool;
a filtering assembly positioned in the gas handling housing and comprising a plurality of wire meshes, wherein the wire meshes are stacked on top of another; and
a liquid spraying member positioned in the gas handling housing and configured to spray a mist over the wire meshes,
wherein the wire meshes which are stacked collectively form a tubular-shaped filtering structure, and the liquid spraying member is surrounded by the tubular-shaped filtering structure,
wherein each of the wire meshes comprises a plurality of three dimensional

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Tsao Chih-Ming
• Chen Po-Cheng
• Wang Deng-An

Classifications

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P14/6528

  In-situ cleaning after layer formation, e.g. removing process residues · CPC title

• H10P70/20 Primary

  Cleaning during device manufacture · CPC title

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P72/0404 Primary

  for general liquid treatment, e.g. etching followed by cleaning · CPC title