Methods of fabricating a semiconductor device having a via structure and an interconnection structure
US-9905458-B2 · Feb 27, 2018 · US
Siew Yongkong holds 2 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 2 |
| Recent patents | 0 |
| First publication | Sep 19, 2017 |
| Latest publication | Feb 27, 2018 |
Year-over-year patent counts for this assignee.
Latest publications where this party is an assignee.
Representative or frequently cited publications from precomputed assignee stats.
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 2 |