Copper Deposition in Wafer Level Packaging of Integrated Circuits
US-2021388519-A1 · Dec 16, 2021 · US
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Macdermid Enthone Inc patents in 2021
Macdermid Enthone Inc was listed as an assignee on 17 patent publications in 2021.
| Metric | Value |
|---|---|
| Company | Macdermid Enthone Inc |
| Year | 2021 |
| Patents | 17 |
Patents
Representative publications for Macdermid Enthone Inc in 2021.
Silver/Tin Electroplating Bath and Method of Using the Same
US-2021381121-A1 · Dec 9, 2021 · US
Gold Plating Bath and Gold Plated Final Finish
US-2021371998-A1 · Dec 2, 2021 · US
Leveler compositions for use in copper deposition in manufacture of microelectronics
US-11168406-B2 · Nov 9, 2021 · US
Cobalt Filling of Interconnects
US-2021332491-A1 · Oct 28, 2021 · US
Top CPC classifications
Most common classification codes for Macdermid Enthone Inc in 2021.
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