Leveler compositions for use in copper deposition in manufacture of microelectronics
US-10519557-B2 · Dec 31, 2019 · US
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Macdermid Enthone Inc patents in 2019
Macdermid Enthone Inc was listed as an assignee on 14 patent publications in 2019.
| Metric | Value |
|---|---|
| Company | Macdermid Enthone Inc |
| Year | 2019 |
| Patents | 14 |
Patents
Representative publications for Macdermid Enthone Inc in 2019.
Copper Electrodeposition in Microelectronics
US-2019390356-A1 · Dec 26, 2019 · US
Compositions including a high molecular weight acid suitable for conductive polymer formation on dielectric substrate
US-10508207-B2 · Dec 17, 2019 · US
Copper Deposition in Wafer Level Packaging of Integrated Circuits
US-2019368064-A1 · Dec 5, 2019 · US
Near Neutral pH Pickle on Multi-metals
US-2019345617-A1 · Nov 14, 2019 · US
Top CPC classifications
Most common classification codes for Macdermid Enthone Inc in 2019.
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