Process for metalization of copper pillars in the manufacture of microelectronics
US-2018355502-A1 · Dec 13, 2018 · US
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Macdermid Enthone Inc patents in 2018
Macdermid Enthone Inc was listed as an assignee on 9 patent publications in 2018.
| Metric | Value |
|---|---|
| Company | Macdermid Enthone Inc |
| Year | 2018 |
| Patents | 9 |
Patents
Representative publications for Macdermid Enthone Inc in 2018.
Elimination of H2S in Immersion Tin Plating Solution
US-2018347038-A1 · Dec 6, 2018 · US
Process for filling vias in the microelectronics
US-10103029-B2 · Oct 16, 2018 · US
Aqueous electrolyte composition having a reduced airborne emission, method and use of this composition
US-10081876-B2 · Sep 25, 2018 · US
Flexible Color Adjustment for Dark Cr(III) Platings
US-2018266008-A1 · Sep 20, 2018 · US
Top CPC classifications
Most common classification codes for Macdermid Enthone Inc in 2018.
| CPC | Patents |
|---|---|
| C25D3/38 | 3 |
| C25D5/02 | 3 |
| C25D5/56 | 3 |
| C23C18/2086 | 2 |
| C23C18/22 | 2 |
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