In mold electronic printed circuit board encapsulation and assembly
US-11112103-B2 · Sep 7, 2021 · US
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Thermal Solution Resources Llc patents
Thermal Solution Resources Llc holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | Mar 24, 2016 |
| Latest publication | Sep 7, 2021 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
In mold electronic printed circuit board encapsulation and assembly
US-2019093874-A1 · Mar 28, 2019 · US
In mold electronic printed circuit board encapsulation and assembly
US-10156352-B2 · Dec 18, 2018 · US
In mold electronic printed circuit board encapsulation and assembly
US-2016084490-A1 · Mar 24, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
In mold electronic printed circuit board encapsulation and assembly
US-11112103-B2 · Sep 7, 2021 · US
In mold electronic printed circuit board encapsulation and assembly
US-2019093874-A1 · Mar 28, 2019 · US
In mold electronic printed circuit board encapsulation and assembly
US-10156352-B2 · Dec 18, 2018 · US
In mold electronic printed circuit board encapsulation and assembly
US-2016084490-A1 · Mar 24, 2016 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Operations & Transport | 4 |
| Mechanical Engineering | 4 |