In mold electronic printed circuit board encapsulation and assembly
US-10156352-B2 · Dec 18, 2018 · US
Thermal Solution Resources Llc was listed as an assignee on 1 patent publication in 2018.
| Metric | Value |
|---|---|
| Company | Thermal Solution Resources Llc |
| Year | 2018 |
| Patents | 1 |
Representative publications for Thermal Solution Resources Llc in 2018.
Most common classification codes for Thermal Solution Resources Llc in 2018.
| CPC | Patents |
|---|---|
| B29C67/246 | 1 |
| B29K2075/00 | 1 |
| B29K2669/00 | 1 |
| B29K2995/0013 | 1 |
| B29L2031/3425 | 1 |
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