In mold electronic printed circuit board encapsulation and assembly

Patent metadata

Field	Value
Publication number	US-11112103-B2
Application number	US-201816184202-A
Country	US
Kind code	B2
Filing date	Nov 8, 2018
Priority date	Apr 19, 2013
Publication date	Sep 7, 2021
Grant date	Sep 7, 2021

Abstract

The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.

First claim

What is claimed is:

1. An assembly comprising:
a heat sink consisting of a thermally conductive thermoplastic polymer composition;
a first electrical/electronic component;
a second electrical/electronic component different from the first electrical/electronic component; and
a polyurethane,
wherein the heat sink partially or fully surrounds the first electrical/electronic component,
wherein the polyurethane encapsulates the second electrical/electronic components to form the assembly,
wherein the first electrical/electronic component is insert molded into the heat sink, and
wherein the polyurethane is bonded to the heat sink.

2. The assembly according to claim 1 , wherein the thermally conductive thermoplastic polymer composition contains an amorphous thermoplastic polymer selected from the group consisting of polypropylene, cyclic olefin copolymers, polycarbonate, polymethylmethacrylate and polystyrene.

3. The assembly according to claim 2 , wherein the thermally conductive thermoplastic polymer composition comprises polycarbonate.

4. The assembly according to claim 1 , wherein the first and second electrical/electronic components are each selected from the group consisting of a printed circuit board, a light emitting diode (LED), a resistor, a constant current driver, a driver/controller, a capacitor, a microprocessor, an integrated circuit, a photocell, a piezo-transducer, an inductor, and a proximity switch.

5. The assembly according to claim 4 , wherein the first electrical/electronic component is selected from the group consisting of a light emitting diode (LED), a resistor, a constant current driver, a capacitor, a microprocessor, an integrated circuit, a photocell, a piezo-transducer, an inductor, and a proximity switch.

6. The assembly according to claim 4 , wherein the second electrical/electronic component is a printed circuit board or a driver/controller.

7. The assembly according to claim 4 , wherein the first electrical/electronic component comprises a light emitting diode and the second electrical/electronic component comprises a driver/controller.

8. The assembly according to claim 1 further comprising at least one of a power supply and a threaded connector.

9. A process of making an assembly comprising:
partially or fully surrounding a first electrical/electronic component with a heat sink consisting of a thermally conductive thermoplastic polymer;
encapsulating a second electrical/electronic component with a reaction injection molded polyurethane; and
forming the assembly by interlocking the reaction injection molded polyurethane with the heat sink,
wherein the second electrical/electronic component is different from the first electrical/electronic component,
wherein the first electrical/electronic component is insert molded into the heat sink, and
wherein the polyurethane is bonded to the heat sink.

10. The process according to claim 9 , wherein the thermally conductive thermoplastic polymer composition comprises an amorphous thermoplastic polymer selected from the group consisting of polypropylene, cyclic olefin copolymers, polycarbonate, polymethylmethacrylate and polystyrene.

11. The process according to claim 10 , wherein the thermally conductive thermoplastic polymer composition comprises polycarbonate.

12. The process according to claim 9 , wherein the first and second electrical/electronic components are each selected from the group consisting of a printed circuit board, a light emitting diode (LED), a resistor, a constant current driver, a driver/controller, a capacitor, a microprocessor, an integrated circuit, a photocell, a piezo-transducer, an inductor, and a proximity switch.

13. The process according to claim 12 , wherein the first electrical/electronic component is selected from the group consisting of a light emitting diode (LED), a resistor, a constant current driver, a capacitor, a microprocessor, an integrated circuit, a photocell, a piezo-transducer, an inductor, and a proximity switch.

14. The process according to claim 12 , wherein the second electrical/electronic component is a printed circuit board or a driver/controller.

15. The process according to claim 12 , wherein the first electrical/electronic component comprises a light emitting diode and the second electrical/electronic component comprises a driver/controller.

16. The process according to claim 12 , further comprising a step of inserting a power supply into a polyurethane reaction injection mold before reaction injection molding the polyurethane.

Assignees

• Covestro Llc
• Thermal Solution Resources Llc

Inventors

• Davis Terry G
• Rocco David
• Sagal Mikhail
• Mccanna Jessee
• Sunderland Nicolas
• Lorenzo James
• Matsco Mark
• Dunay Kevin

Classifications

• F21V23/004

  arranged on a substrate, e.g. a printed circuit board · CPC title

• F21V29/507

  of means for protecting lighting devices from damage, e.g. housings · CPC title

• B29C67/246

  Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM] (casting monomers B29C39/006, mixing construction B29B7/74) · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• F21V29/86

  Ceramics or glass · CPC title