Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion
US-9520306-B2 · Dec 13, 2016 · US
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Mclellan Neil patents in 2016
Mclellan Neil was listed as an assignee on 2 patent publications in 2016.
| Metric | Value |
|---|---|
| Company | Mclellan Neil |
| Year | 2016 |
| Patents | 2 |
Patents
Representative publications for Mclellan Neil in 2016.
Methods of fabricating semiconductor chip solder structures
US-9318457-B2 · Apr 19, 2016 · US
Top CPC classifications
Most common classification codes for Mclellan Neil in 2016.
| CPC | Patents |
|---|---|
| H01L2924/00 | 2 |
| H01L2924/00014 | 2 |
| H01L2924/01029 | 2 |
| H01L2924/01047 | 2 |
| H01L2924/01082 | 2 |
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