Apparatuses for bonding semiconductor chips
US-9704732-B2 · Jul 11, 2017 · US
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Hwang Yisung patents in 2017
Hwang Yisung was listed as an assignee on 1 patent publication in 2017.
| Metric | Value |
|---|---|
| Company | Hwang Yisung |
| Year | 2017 |
| Patents | 1 |
Patents
Representative publications for Hwang Yisung in 2017.
Top CPC classifications
Most common classification codes for Hwang Yisung in 2017.
| CPC | Patents |
|---|---|
| H01L21/67144 | 1 |
| H01L2924/00 | 1 |
| H01L2924/0002 | 1 |
| H10P72/0446 | 1 |
| H10W95/00 | 1 |
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