Semiconductor device and method of forming protective layer around cavity of semiconductor die
US-11804416-B2 · Oct 31, 2023 · US
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Utac Headquarters Pte Ltd patents in 2023
Utac Headquarters Pte Ltd was listed as an assignee on 17 patent publications in 2023.
| Metric | Value |
|---|---|
| Company | Utac Headquarters Pte Ltd |
| Year | 2023 |
| Patents | 17 |
Patents
Representative publications for Utac Headquarters Pte Ltd in 2023.
Semiconductor Packages and Methods of Forming RDL and Side and Back Protection for Semiconductor Device
US-2023343668-A1 · Oct 26, 2023 · US
Hermetic semiconductor packages
US-11784102-B2 · Oct 10, 2023 · US
Plasma diced wafers and methods thereof
US-2023274979-A1 · Aug 31, 2023 · US
Semiconductor packages and methods of packaging semiconductor devices
US-11710681-B2 · Jul 25, 2023 · US
Top CPC classifications
Most common classification codes for Utac Headquarters Pte Ltd in 2023.
| CPC | Patents |
|---|---|
| H01L21/78 | 6 |
| H10P54/00 | 6 |
| H10P72/7416 | 5 |
| H10W72/073 | 5 |
| H10F39/804 | 4 |
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