Semiconductor packages and methods of packaging semiconductor devices

Patent metadata

Field	Value
Publication number	US-11710681-B2
Application number	US-202117495788-A
Country	US
Kind code	B2
Filing date	Oct 6, 2021
Priority date	Nov 7, 2018
Publication date	Jul 25, 2023
Grant date	Jul 25, 2023

Abstract

An embodiment related to a device. The device includes a first die with first and second die surfaces. The second die surface is bonded to a first die attach pad (DAP) disposed on a first substrate surface of a package substrate and the first die surface includes a first die contact pad. The device also includes a first clip bond including a first clip bond horizontal planar portion attached to the first die contact pad on the first die surface, and a first clip bond vertical portion disposed on an edge of the first clip bond horizontal planar portion. The first clip bond vertical portion is attached to a first substrate bond pad on the first substrate surface. The device further includes a first conductive clip-die bonding layer with spacers on the first die contact pad of the first die. The first conductive clip-die bonding layer bonds the first clip bond horizontal planar portion to the first die contact pad, and the spacers maintain a uniform Bond Line Thickness (BLT) of the first conductive clip-die bonding layer.

First claim

What is claimed is:

1. A device comprising:
a first die with first and second die surfaces, the second die surface is bonded to a first die attach pad (DAP) disposed on a first substrate surface of a package substrate and the first die surface includes a first die contact pad;
a first clip bond, wherein the first clip bond includes
a first clip bond horizontal planar portion attached to the first die contact pad on the first die surface, and
a first clip bond vertical portion disposed on an edge of the first clip bond horizontal planar portion, the first clip bond vertical portion is attached to a first substrate bond pad on the first substrate surface; and

a first conductive clip-die bonding layer with spacers dispersed therein, the first conductive clip bonding layer is disposed on the first die contact pad of the first die, the first conductive clip-die bonding layer bonds the first clip bond horizontal planar portion to the first die contact pad, wherein the spacers comprise a spacer size which is less than a Bond Line Thickness (BLT) of the first conductive clip-die bonding layer, the spacers facilitate in maintaining a uniform BLT.

2. The device in claim 1 wherein the first clip bond vertical portion comprises a step profile.

3. The device in claim 1 wherein the first clip bond vertical portion comprises a base having an extension portion along a plane of the first substrate bond pad.

4. The device in claim 1 further comprises a first conductive die-substrate bonding layer with spacers, wherein the first conductive die-substrate bonding layer bonds the first clip bond vertical portion of the first clip bond to the first substrate bond pad.

5. The device in claim 4 wherein the bonding layers are screen printed.

6. The device in claim 4 wherein the spacers comprise a material having a higher melting point than the first conductive clip-die bonding layer.

7. The device in claim 4 wherein the spacers have a size equal to or smaller than the Bond Line Thickness (BLT).

8. The device in claim 4 further comprises
a second die with first and second die surfaces, the second die surface is bonded to the first clip bond horizontal planar portion by a second conductive clip-die bonding layer with spacers and the first die surface includes a second die contact pad;
a second clip bond, wherein the second clip bond includes
a second clip bond horizontal planar portion attached to the second die contact pad on the first die surface, and
a second clip bond vertical portion disposed on an edge of the second clip bond horizontal planar portion, the second clip bond vertical portion is attached to a second substrate bond pad on the first substrate surface; and

a third conductive clip-die bonding layer with spacers on the second die contact pad of the second die, the third conductive clip-die bonding layer bonds the second clip bond horizontal planar portion to the second die contact pad.

9. The device in claim 8 further comprises a second conductive die-substrate bonding layer with spacers, wherein the second conductive die-substrate bonding layer bonds the second clip bond vertical portion to the second substrate bond pad.

10. The device in claim 4 further comprises
a second die with first and second die surfaces, the second die surface is attached to a second DAP disposed on the first substrate surface and the first die surface includes a second die contact pad; and
a second conductive clip-die bonding layer with spacers on the second die contact pad of the second die, the second conductive clip-die bonding layer bonds the first clip bond horizontal planar portion to the second die contact pad.

11. The device in claim 10 wherein the first clip bond comprises 2 first clip bond vertical portions disposed on opposing edges of the first clip bond horizontal planar portion.

12. The device in claim 11 wherein the 2 first clip bond vertical portions are attached to the first substrate bond pad and a second substrate bond pad respectively.

13. The device in claim 1 wherein the first die is a MOSFET die having source, drain and gate terminals.

14. A device comprising:
a first die with first and second die surfaces, the second die surface is bonded, by a conductive die-substrate bonding layer, to a first die attach pad (DAP) disposed on a first substrate surface of a package substrate and the first die surface includes a first die contact pad;
a first clip bond, wherein the first clip bond includes
a first clip bond horizontal planar portion attached to the first die contact pad on the first die surface, and
a first clip bond vertical portion disposed on an edge of the first clip bond horizontal planar portion, the first clip bond vertical portion is attached to a first substrate bond pad on the first substrate surface by a first conductive clip-substrate bonding layer;

a first conductive clip-die bonding layer with spacers on the first die contact pad of the first die, the first conductive clip-die bonding layer bonds the first clip bond horizontal planar portion to the first die contact pad;
a second die with first and second die surfaces, the second die surface is bonded to the first clip bond horizontal planar portion by a second conductive clip-die bonding layer with spacers and the first die surface includes a second die contact pad;
a second clip bond, wherein the second clip bond includes
a second clip bond horizontal planar portion attached to the second die contact pad on the first die surface, and
a second clip bond vertical portion disposed on an edge of the second clip bond horizontal planar portion, the second clip bond vertical portion is attached to a second substrate bond pad on the first substrate surface; and

a third conductive clip-die bonding layer with spacers on the second die contact pad of the second die, the third conductive clip-die bonding layer bonds the second clip bond horizontal planar portion to the second die contact pad.

15. The device in claim 14 wherein the first conductive clip-substrate bonding layer and the conductive die-substrate bonding layer comprise spacers.

16. The device in claim 15 wherein the spacers have a size equal to or smaller than a Bond Line Thickness (BLT).

17. The device in claim 15 wherein the spacers comprise a material having a higher melting point than the bonding layers.

18. A device comprising:
a first die with first and second die surfaces, the second die surface is bonded to a first die attach pad (DAP) disposed on a first substrate surface of a package substrate and the first die surface includes a first die contact pad;
a first clip bond having a horizontal planar portion attached to the first die contact pad on the first die surface; and
a first conductive clip-die bonding layer with spacers dispersed therein, the first conductive clip bonding layer is disposed on the first die contact pad of the first die, the first conductive clip-die bonding layer bonds the first clip bond horizontal planar portion to the first die contact pad, wherein the spacers comprise a spacer size which is less than a Bond Line Thickness (BLT) of the first conductive clip-die bonding layer, the spacers facilitate in maintaining a uniform BLT.

19. The device in claim 18 wherein the spacer size is about 50-90% of the BLT.

20. The device in claim 19 wherein the spacers comprise a material having a higher melting point than the bonding layers.

Assignees

• Utac Headquarters Pte Ltd

Inventors

• Chaowasakoo Tanawan
• Tan Hua Hong
• Laylo Alexander Lucero
• Jaengkrajarng Thanawat

Classifications

• H10W72/07654

  changes in dispositions · CPC title

• H10W72/647

  Dispositions of multiple strap connectors · CPC title

• H10W72/886

  Die-attach connectors and strap connectors · CPC title

• H10W72/07631

  Techniques · CPC title

• H10W72/07636

  Soldering or alloying · CPC title