Semiconductor package with partial plating on contact side surfaces
US-10515878-B1 · Dec 24, 2019 · US
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Utac Headquarters Pte Ltd patents in 2019
Utac Headquarters Pte Ltd was listed as an assignee on 16 patent publications in 2019.
| Metric | Value |
|---|---|
| Company | Utac Headquarters Pte Ltd |
| Year | 2019 |
| Patents | 16 |
Patents
Representative publications for Utac Headquarters Pte Ltd in 2019.
Semiconductor packages and methods of packaging semiconductor devices
US-2019348387-A1 · Nov 14, 2019 · US
Semiconductor packages and methods of packaging semiconductor devices
US-10403592-B2 · Sep 3, 2019 · US
Semiconductor packages and methods for forming semiconductor package
US-10381280-B2 · Aug 13, 2019 · US
Semiconductor package with multiple stacked leadframes and a method of manufacturing the same
US-10361146-B2 · Jul 23, 2019 · US
Top CPC classifications
Most common classification codes for Utac Headquarters Pte Ltd in 2019.
| CPC | Patents |
|---|---|
| H10W72/0198 | 12 |
| H10W74/014 | 11 |
| H10W90/756 | 11 |
| H10W72/075 | 9 |
| H10W72/884 | 9 |
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