Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion
US-9520306-B2 · Dec 13, 2016 · US
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Utac Headquarters Pte Ltd patents in 2016
Utac Headquarters Pte Ltd was listed as an assignee on 10 patent publications in 2016.
| Metric | Value |
|---|---|
| Company | Utac Headquarters Pte Ltd |
| Year | 2016 |
| Patents | 10 |
Patents
Representative publications for Utac Headquarters Pte Ltd in 2016.
Semiconductor packages and methods of packaging semiconductor devices
US-9508623-B2 · Nov 29, 2016 · US
Leadframe area array packaging technology
US-9472532-B2 · Oct 18, 2016 · US
Leadframe feature to minimize flip-chip semiconductor die collapse during flip-chip reflow
US-9449900-B2 · Sep 20, 2016 · US
Semiconductor packages and methods of packaging semiconductor devices
US-9391026-B2 · Jul 12, 2016 · US
Top CPC classifications
Most common classification codes for Utac Headquarters Pte Ltd in 2016.
| CPC | Patents |
|---|---|
| H10W74/00 | 7 |
| H10W72/0198 | 6 |
| H01L21/78 | 5 |
| H01L2924/00 | 5 |
| H01L2924/00014 | 5 |
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