Electronic component assembly
US-9426899-B2 · Aug 23, 2016 · US
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Nakatani Seiichi patents
Nakatani Seiichi holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | Mar 10, 2015 |
| Latest publication | Aug 23, 2016 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Hybrid substrate, method for manufacturing the same, and semiconductor integrated circuit package
US-9107306-B2 · Aug 11, 2015 · US
Substrate for mounting light-emitting element and light-emitting device
US-9076714-B2 · Jul 7, 2015 · US
Flexible semiconductor device
US-8975626-B2 · Mar 10, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Electronic component assembly
US-9426899-B2 · Aug 23, 2016 · US
Hybrid substrate, method for manufacturing the same, and semiconductor integrated circuit package
US-9107306-B2 · Aug 11, 2015 · US
Substrate for mounting light-emitting element and light-emitting device
US-9076714-B2 · Jul 7, 2015 · US
Flexible semiconductor device
US-8975626-B2 · Mar 10, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H01L2924/09701 | 3 |
| H01L2924/00 | 2 |
| H10W90/00 | 1 |
| H10H20/8581 | 1 |
| H10H20/8506 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 4 |
| Cross-Sectional Technologies | 1 |