Metal-clad laminate, method for producing same, and flexible printed board
US-9392689-B2 · Jul 12, 2016 · US
Nakagawa Hideto was listed as an assignee on 1 patent publication in 2016.
| Metric | Value |
|---|---|
| Company | Nakagawa Hideto |
| Year | 2016 |
| Patents | 1 |
Representative publications for Nakagawa Hideto in 2016.
Most common classification codes for Nakagawa Hideto in 2016.
| CPC | Patents |
|---|---|
| B32B15/092 | 1 |
| B32B2270/00 | 1 |
| B32B2457/08 | 1 |
| B32B37/14 | 1 |
| B32B38/10 | 1 |
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