Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with the same
US-8928158-B2 · Jan 6, 2015 · US
Han Seung was listed as an assignee on 1 patent publication in 2015.
| Metric | Value |
|---|---|
| Company | Han Seung |
| Year | 2015 |
| Patents | 1 |
Representative publications for Han Seung in 2015.
Most common classification codes for Han Seung in 2015.
| CPC | Patents |
|---|---|
| C08G59/20 | 1 |
| C08G59/3218 | 1 |
| C08K3/00 | 1 |
| C08L63/00 | 1 |
| C08L63/04 | 1 |
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