Curable epoxy composition, film, laminated film, prepreg, laminate, cured article, and composite article
US-2017313809-A1 · Nov 2, 2017 · US
characterised by the epoxy compounds used
characterised by the epoxy compounds used · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08G59/20 |
| Official title | characterised by the epoxy compounds used |
| Display label | characterised by the epoxy compounds used |
| Total patents | 283 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 18 |
| 2016 | 19 |
| 2017 | 23 |
| 2018 | 29 |
| 2019 | 34 |
| 2020 | 34 |
| 2021 | 24 |
| 2022 | 26 |
| 2023 | 25 |
| 2024 | 23 |
| 2025 | 22 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Resin composition, resin film, method for producing resin film, method for producing semiconductor device, and semiconductor device
US-2017313904-A1 · Nov 2, 2017 · US
Polymerizable compound and optically anisotropic body
US-2017306233-A1 · Oct 26, 2017 · US
Epoxy Resin Composition for Fiber-Reinforced Composite Material, Method for Producing Epoxy Resin Composition for Fiber-Reinforced Composite Material, Prepreg, and Honey-Comb Panel
US-2017292023-A1 · Oct 12, 2017 · US
Photocurable and thermosetting resin composition, cured product, and laminate
US-2017283649-A1 · Oct 5, 2017 · US
Resin composition
US-2017267808-A1 · Sep 21, 2017 · US
Thermally expandable fire resistant resin composition
US-2017253691-A1 · Sep 7, 2017 · US
Toughening of Epoxy Thermosets
US-2017247499-A1 · Aug 31, 2017 · US
Curable epoxy compositions
US-9738783-B2 · Aug 22, 2017 · US
Epoxy compound having alkoxysilyl group, method of preparing the same, composition and cured product comprising the same, and use thereof
US-9732182-B2 · Aug 15, 2017 · US
Fast curing compositions
US-2017226274-A1 · Aug 10, 2017 · US
Polyurethane-modified epoxy resin, method for producing same, epoxy resin composition and cured product
US-2017198085-A1 · Jul 13, 2017 · US
Resin composition and composite structure containing resin
US-9695312-B2 · Jul 4, 2017 · US
Epoxy resin compositions for production of storage-stable composites
US-2017166687-A1 · Jun 15, 2017 · US
Liquid sealing material, and electronic component using same
US-2017145251-A1 · May 25, 2017 · US
Composition for heat-dissipation members, heat-dissipation member, and electronic device
US-2017137561-A1 · May 18, 2017 · US
Adhesive compositions
US-2017107409-A1 · Apr 20, 2017 · US
Silicone-modified epoxy resin, composition containing the epoxy resin, and cured product of same
US-2017107322-A1 · Apr 20, 2017 · US
Liquid resin composition, cured product, wiring structure, and package using wiring structure
US-9624369-B2 · Apr 18, 2017 · US
Curable composition, article, method of curing, and tack-free reaction product
US-9611360-B2 · Apr 4, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08G59/20?
- CPC C08G59/20 is the Cooperative Patent Classification code for “characterised by the epoxy compounds used.”
- How many patents are filed under CPC C08G59/20 (characterised by the epoxy compounds used)?
- Our database includes 283 publications tagged with this CPC code.
- Is patent activity under CPC C08G59/20 growing?
- Publication counts under this code: 23 in 2024 vs 22 in 2025 (latest complete years).