Plastic substrate and device including the same
US-9733503-B2 · Aug 15, 2017 · US
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Kim Jeong Han patents in 2017
Kim Jeong Han was listed as an assignee on 3 patent publications in 2017.
| Metric | Value |
|---|---|
| Company | Kim Jeong Han |
| Year | 2017 |
| Patents | 3 |
Patents
Representative publications for Kim Jeong Han in 2017.
Apparatus and methods for filling a wafer via with solder
US-2017148678-A1 · May 25, 2017 · US
Apparatus for filling a wafer via with solder
US-9603254-B2 · Mar 21, 2017 · US
Top CPC classifications
Most common classification codes for Kim Jeong Han in 2017.
| CPC | Patents |
|---|---|
| H01L21/76898 | 2 |
| H10W20/023 | 2 |
| H10W20/0245 | 2 |
| H10W20/0261 | 2 |
| B23K1/0016 | 1 |
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