Plastic substrate and device including the same

Patent metadata

Field	Value
Publication number	US-9733503-B2
Application number	US-200913001958-A
Country	US
Kind code	B2
Filing date	Jun 30, 2009
Priority date	Jun 30, 2008
Publication date	Aug 15, 2017
Grant date	Aug 15, 2017

Abstract

Disclosed is a plastic substrate, which includes a plastic film, a reflective and/or conductive metal layer, and a resin layer having a conductive material dispersed therein and which is useful as a lower substrate of a transmissive electronic paper display device or a display device.

First claim

The invention claimed is:

1. A plastic substrate, comprising:
a plastic film, wherein the plastic film has a surface roughness of 2 μm or less;
a conductive metal layer formed on and in contact with the plastic film, wherein the conductive metal layer has a thickness ranging from 1 to 50 nm;
a passivation layer formed on the metal layer; and
a resin layer having a conductive material dispersed therein formed on the passivation layer, wherein the resin layer has a thickness ranging from 10 nm to 2.5 μm, and wherein the resin layer includes 0.001-1 part by weight of carbon nanotubes based on 100 parts by weight of a solid content of the resin;
wherein the plastic film, passivation layer and resin layer are formed from a polyimide varnish, being imidized,
wherein the polyimide varnish have an average coefficient of linear thermal expansion (CTE) of 50.0 ppm/° C. or less when measured in a temperature range from 50° C. to 250° C. using a thermomechanical analyzer for a film thickness of 50-100 μm, with a yellowness index of 15 or less, and
wherein the plastic substrate has a light transmittance of 50% or more at a wavelength of 500 nm and a surface resistivity of 2.5×10 6 Ω/sq. or less.

2. The plastic substrate according to claim 1 , wherein the metal layer is a conductive metal layer selected from the group consisting of magnesium, barium, gold, aluminum, titanium, silver, platinum, tantalum, palladium, alloys thereof, an oxide thereof, indium tin oxide and indium zinc oxide.

3. The plastic substrate according to claim 2 , wherein the conductive metal layer comprises indium tin oxide or indium zinc oxide.

4. The plastic substrate according to claim 2 , wherein the conductive metal layer is selected from the group consisting of magnesium, barium, gold and oxides thereof.

5. The plastic substrate according to claim 2 , wherein the conductive metal layer comprises indium tin oxide.

6. The plastic substrate according to claim 2 , wherein the metal layer is a conductive metal layer selected from the group consisting of barium, platinum and an oxide thereof.

7. The plastic substrate according to claim 1 , wherein the plastic film is a polyimide film having color coordinates in which L is 90 or more, a is 5 or less and b is 5 or less when measured using a UV spectrophotometer for a film thickness of 50-100 μm.

8. The plastic substrate according to claim 1 , wherein the passivation layer is a polyimide layer having an average transmittance of 85% or more at 380˜780 nm when measured using a UV spectrophotometer for a film thickness of 50-100 μm.

9. The plastic substrate according to claim 1 , wherein the passivation layer is a polyimide layer having a transmittance of 88% or more at 550 nm and a transmittance of 70% or more at 420 nm when measured using a UV spectrophotometer for a film thickness of 50-100 μm.

10. The plastic substrate according to claim 1 , wherein the resin layer includes 2-100 parts by weight of indium tin oxide powder based on 100 parts by weight of a solid content of the resin.

11. The plastic substrate according to claim 10 , wherein the indium tin oxide powder contains 80-95 wt % of indium oxide and 5-20 wt % of tin oxide.

12. The plastic substrate according to claim 1 , further comprising a chemical resistance layer formed on at least one surface of the plastic film.

13. The plastic substrate according to claim 12 , wherein the chemical resistance layer comprises at least one resin selected from the group consisting of an acrylic resin, an epoxy-based resin, polysilazane and a polyimide-based resin.

14. The plastic substrate according to claim 1 , further comprising an inorganic layer formed on a lower surface of the plastic film or a lower surface of the metal layer.

15. The plastic substrate according to claim 14 , wherein the inorganic layer is provided in a form of a monolayer or multilayer structure using at least one inorganic material selected from the group consisting of SiNx, AlxOy, and SiOx.

16. The plastic substrate according to claim 1 , further comprising a metal oxide layer formed on an upper surface or a lower surface of the resin layer having the conductive material dispersed therein.

17. The plastic substrate according to claim 16 , wherein the metal oxide layer comprises silver oxide.

18. The plastic substrate according to claim 1 , wherein the plastic film has a surface roughness of 0.001-0.04 μm.

19. A transmissive electronic paper display device, comprising the plastic substrate of claim 1 as a lower substrate.

20. A display device, comprising the plastic substrate of claim 1 as a lower substrate.

21. An organic electroluminescent device, comprising the plastic substrate of claim 1 as a lower substrate.

Assignees

• Jung Hak Gee
• Kim Jeong Han
• Park Hyo Jun
• Kolon Inc

Inventors

• Jung Hak Gee
• Kim Jeong Han
• Park Hyo Jun

Classifications

• Y10T428/269

  including synthetic resin or polymer layer or component · CPC title

• G02F2201/50

  Protective arrangements · CPC title

• Y10T428/31511

  Of epoxy ether · CPC title

• G02F2201/503

  Arrangements improving the resistance to shock · CPC title

• G02F1/133305 Primary

  Flexible substrates, e.g. plastics, organic film · CPC title