Apparatus for filling a wafer via with solder

Patent metadata

Field	Value
Publication number	US-9603254-B2
Application number	US-201214129076-A
Country	US
Kind code	B2
Filing date	Jul 10, 2012
Priority date	Jul 12, 2011
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via.

First claim

What is claimed is:

1. A wafer via solder filling device comprising:
a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space;
a fixing unit for fixing the wafer having a via hole formed in one surface in the accommodation space, thereby sealing the accommodation space; and
a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via hole,
wherein a porous plate which has a through-hole is disposed on a top surface of the wafer, to prevent the wafer from being bent by a suction force provided from the fixing unit.

2. The wafer via solder filling device according to claim 1 ,
wherein the pressing unit comprises, a pressing board provided in the solder bath, with a predetermined area corresponding to the accommodation space, to transfer the molten solder arranged in the solder bath; and
a pressing cylinder connected to the pressing board through a bottom of the solder bath to drive the pressing board vertically.

3. The wafer via solder filling device according to claim 1 , wherein a heating portion is provided in one or more of the solder bath and the pressing unit to prevent the molten solder from being hardened by providing heat to the molten solder arranged in the solder bath.

4. The wafer via solder filling device according to claim 1 , wherein a size of the through-hole of the porous plate is larger than a size of the via hole of the wafer.

5. A wafer via solder filling device comprising:
a solder bath including an accommodation space for accommodating a molten solder, with an open top;
a fixing unit for providing a suction force to a wafer having a via hole which extends from a top surface of the wafer to a bottom surface of the wafer and fixing the wafer in the accommodation space; and
a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via hole;
wherein the via hole is filled with the molten solder by the suction force in an upper direction of the wafer and a pressure which is provided in a bottom surface of the wafer by the pressing unit.

6. The wafer via solder filling device according to claim 5 , further comprising:
a porous plate provided between the top surface of the wafer and the fixing unit, the porous plate comprising a plurality of through-holes formed vertically, to prevent the wafer from being bent by the suction force provided from the fixing unit.

7. The wafer via solder filling device according to claim 6 , wherein a size of the through-hole of the porous plate is larger than a size of the via hole of the wafer.

8. The wafer via solder filling device according to claim 5 , wherein the pressing unit the pressing unit comprises,
a pressing board provided in the solder bath, with a predetermined area corresponding to the accommodation space, to transfer the molten solder arranged in the solder bath; and
a pressing cylinder connected to the pressing board through a bottom of the solder bath to drive the pressing board vertically.

9. The wafer via solder filling device according to claim 5 , wherein a heating portion is provided in one or more of the solder bath and the pressing unit to prevent the molten solder from being hardened by providing heat to the molten solder arranged in the solder bath.

Assignees

• Yoo Sehoon
• Lee Chang Woo
• Kim Jun Ki
• Kim Jeong Han
• Ko Young Ki
• Korea Ind Tech Inst

Inventors

• Yoo Sehoon
• Lee Chang Woo
• Kim Jun Ki
• Kim Jeong Han
• Ko Young Ki

Classifications

• H10W20/023 Primary

  the interconnections being through-semiconductor vias · CPC title

• H10W20/0245

  comprising use of blind vias during the manufacture · CPC title

• H10W20/0261

  characterised by the filling method or the material of the conductive fill · CPC title

• H10W72/00 Primary

  Interconnections or connectors in packages · CPC title

• H01L2924/0002

  Electricity · mapped topic