Packaging with interposer frame
US-9991190-B2 · Jun 5, 2018 · US
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Chen Chen Shien patents in 2018
Chen Chen Shien was listed as an assignee on 2 patent publications in 2018.
| Metric | Value |
|---|---|
| Company | Chen Chen Shien |
| Year | 2018 |
| Patents | 2 |
Patents
Representative publications for Chen Chen Shien in 2018.
Bump structures in semiconductor device and packaging assembly
US-9905524-B2 · Feb 27, 2018 · US
Top CPC classifications
Most common classification codes for Chen Chen Shien in 2018.
| CPC | Patents |
|---|---|
| H01L2924/00014 | 2 |
| H01L2924/181 | 2 |
| H10W74/00 | 2 |
| H10W90/724 | 2 |
| H01L21/568 | 1 |
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