Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly
US-9601350-B2 · Mar 21, 2017 · US
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Yamauchi Akira patents
Yamauchi Akira holds 1 patent in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 1 |
| Recent patents | 0 |
| First publication | Mar 21, 2017 |
| Latest publication | Mar 21, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Not enough yearly data to assess filing trend yet.
| Year | Patents |
|---|---|
| 2017 | 1 |
| Year | Patents |
|---|---|
| 2017 | 1 |
Recent patents
Latest publications where this party is an assignee.
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W10/181 | 1 |
| H10P90/1914 | 1 |
| H10P72/0436 | 1 |
| H10P72/0428 | 1 |
| H10P70/12 | 1 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Operations & Transport | 1 |
| Electricity | 1 |