Semiconductor package substrate, method for fabricating the same, and electronic package having the same
US-2020388564-A1 · Dec 10, 2020 · US
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Phoenix Pioneer Technology Co Ltd patents in 2020
Phoenix Pioneer Technology Co Ltd was listed as an assignee on 11 patent publications in 2020.
| Metric | Value |
|---|---|
| Company | Phoenix Pioneer Technology Co Ltd |
| Year | 2020 |
| Patents | 11 |
Patents
Representative publications for Phoenix Pioneer Technology Co Ltd in 2020.
Package substrate
US-2020388640-A1 · Dec 10, 2020 · US
Semiconductor package carrier board, method for fabricating the same, and electronic package having the same
US-2020388552-A1 · Dec 10, 2020 · US
Method of fabricating package substrates
US-2020332429-A1 · Oct 22, 2020 · US
Semiconductor package substrate, electronic package and methods for fabricating the same
US-2020312756-A1 · Oct 1, 2020 · US
Top CPC classifications
Most common classification codes for Phoenix Pioneer Technology Co Ltd in 2020.
| CPC | Patents |
|---|---|
| H10W70/093 | 7 |
| H10W70/635 | 7 |
| H10W70/685 | 7 |
| H10W70/65 | 6 |
| H10W90/724 | 6 |
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