Semiconductor Package Structure and Method of Making the Same
US-2018358304-A1 · Dec 13, 2018 · US
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Phoenix Pioneer Technology Co Ltd patents in 2018
Phoenix Pioneer Technology Co Ltd was listed as an assignee on 22 patent publications in 2018.
| Metric | Value |
|---|---|
| Company | Phoenix Pioneer Technology Co Ltd |
| Year | 2018 |
| Patents | 22 |
Patents
Representative publications for Phoenix Pioneer Technology Co Ltd in 2018.
Package structure and method of fabricating the same
US-2018315678-A1 · Nov 1, 2018 · US
Manufacturing method of package substrate with metal on conductive portions
US-10117340-B2 · Oct 30, 2018 · US
Interposer substrate and method of fabricating the same
US-2018286794-A1 · Oct 4, 2018 · US
Package substrate having a plurality of chips electrically connected by conductive vias and wiring bonding
US-10079220-B2 · Sep 18, 2018 · US
Top CPC classifications
Most common classification codes for Phoenix Pioneer Technology Co Ltd in 2018.
| CPC | Patents |
|---|---|
| H10W90/724 | 16 |
| H10W70/635 | 14 |
| H10W70/685 | 12 |
| H10W70/05 | 10 |
| H10W74/00 | 10 |
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