Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
This page is not indexed by search engines while we improve data quality.
Nippon Steel Chemical & Mat Co Ltd — Operations & Transport
Nippon Steel Chemical & Mat Co Ltd holds 119 patents in Operations & Transport, with representative filings summarized below.
| Metric | Value |
|---|---|
| Company | Nippon Steel Chemical & Mat Co Ltd |
| Technology | Operations & Transport |
| Patents in slice | 119 |
| Recent patents in slice | 40 |
| First year | 2019 |
| Last year | 2026 |
Representative patents
Notable publications linking Nippon Steel Chemical & Mat Co Ltd to Operations & Transport.
Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
Al bonding wire
US-12532767-B2 · Jan 20, 2026 · US
Al bonding wire
US-12532767-B2 · Jan 20, 2026 · US
Iron-nickel alloy foil, method for manufacturing iron-nickel alloy foil, and component
US-2025346979-A1 · Nov 13, 2025 · US
Recent filings
Latest patents from Nippon Steel Chemical & Mat Co Ltd in Operations & Transport.
Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
Copper alloy bonding wire for semiconductor devices
US-2026097454-A1 · Apr 9, 2026 · US
Al bonding wire
US-12532767-B2 · Jan 20, 2026 · US
Al bonding wire
US-12532767-B2 · Jan 20, 2026 · US
Iron-nickel alloy foil, method for manufacturing iron-nickel alloy foil, and component
US-2025346979-A1 · Nov 13, 2025 · US
Related pages
Navigate to parent entity pages.