Integrated circuit devices having through-silicon vias and methods of manufacturing such devices
US-9735090-B2 · Aug 15, 2017 · US
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Park Ji-Soon patents
Park Ji-Soon holds 5 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 5 |
| Recent patents | 0 |
| First publication | Jan 13, 2015 |
| Latest publication | Aug 15, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Server, client device, method for generating a transport stream thereof and processing the transport stream thereof
US-9100677-B2 · Aug 4, 2015 · US
Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same
US-9064941-B2 · Jun 23, 2015 · US
Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same
US-8963336-B2 · Feb 24, 2015 · US
Method of forming a dielectric layer having an ONO structure using an in-situ process
US-8932964-B2 · Jan 13, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Integrated circuit devices having through-silicon vias and methods of manufacturing such devices
US-9735090-B2 · Aug 15, 2017 · US
Server, client device, method for generating a transport stream thereof and processing the transport stream thereof
US-9100677-B2 · Aug 4, 2015 · US
Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same
US-9064941-B2 · Jun 23, 2015 · US
Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the same
US-8963336-B2 · Feb 24, 2015 · US
Method of forming a dielectric layer having an ONO structure using an in-situ process
US-8932964-B2 · Jan 13, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| H10W20/0245 | 3 |
| H10W20/0249 | 3 |
| H10W20/2134 | 3 |
| H10W74/00 | 3 |
| H10W74/15 | 3 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 5 |