CMP fluid and method for polishing palladium
US-10796921-B2 · Oct 6, 2020 · US
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Minami Hisataka patents
Minami Hisataka holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | May 26, 2015 |
| Latest publication | Oct 6, 2020 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
CMP polishing solution and polishing method
US-9799532-B2 · Oct 24, 2017 · US
CMP polishing fluid, method for manufacturing same, method for manufacturing composite particle, and method for polishing base material
US-9447306-B2 · Sep 20, 2016 · US
Method for producing abrasive grains, method for producing slurry, and method for producing polishing liquid
US-9039796-B2 · May 26, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
CMP fluid and method for polishing palladium
US-10796921-B2 · Oct 6, 2020 · US
CMP polishing solution and polishing method
US-9799532-B2 · Oct 24, 2017 · US
CMP polishing fluid, method for manufacturing same, method for manufacturing composite particle, and method for polishing base material
US-9447306-B2 · Sep 20, 2016 · US
Method for producing abrasive grains, method for producing slurry, and method for producing polishing liquid
US-9039796-B2 · May 26, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| C09G1/02 | 4 |
| H10P52/00 | 3 |
| C09K3/1463 | 3 |
| C09K3/14 | 3 |
| H10P95/062 | 2 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Chemistry & Metallurgy | 4 |
| Electricity | 4 |
| Operations & Transport | 3 |