Antioxidants for post-CMP cleaning formulations

USRE46427E · US · E1

Patent metadata
FieldValue
Publication numberUS-RE46427-E
Application numberUS-201514595758-A
CountryUS
Kind codeE1
Filing dateJan 13, 2015
Priority dateSep 21, 2006
Publication dateJun 6, 2017
Grant dateJun 6, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic device without compromising the low-k dielectric material or the copper interconnect material.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of removing post-chemical mechanical polishing (CMP) residue from a microelectronic device having said post-CMP residue thereon, said method comprising contacting the microelectronic device with a cleaning composition for sufficient time to at least partially clean said post-CMP residue from the microelectronic device, wherein the cleaning composition includes at least one solvent consists of water, at least one corrosion inhibitor, at least one quaternary base, and at least one amine, wherein the at least one corrosion inhibitor comprises a species is selected from the group consisting of barbituric acid and derivatives thereof, glucuronic acid, squaric acid, alpha-keto acids, adenosine and derivatives thereof, guanine, hypoxanthine, xanthine, theobromine, caffeine, isoguanine, phenanthroline/ascorbic acid, nicotinamide and derivatives thereof, flavonols and derivatives thereof, anthocyanins and derivatives thereof, flavonol/anthocyanin, and combinations thereof, wherein the at least one amine is selected from the group consisting of aminoethylethanolamine, N-methylaminoethanol, aminoethoxyethanol, dimethylaminoethoxyethanol, diethanolamine, N-methyldiethanolamine, monoethanolamine, triethanolamine, 1-amino-2-propanol, 2-amino-1-butanol, isobutanolamine, triethylenediamine, other C 1 -C 8 alkanolamines and combinations thereof, and wherein the at least one quaternary base is selected from the group consisting of tetraethylammonium hydroxide (TEAH), tetramethyammonium hydroxide (TMAH), tetrapropylammonium hydroxide (TPAH), tetrabutylammonium hydroxide (TBAH), tributylmethylammonium hydroxide (TBMAH), benzyltrimethylammonium hydroxide (BTMAH), and combinations thereof. 2. The method of claim 1 , wherein the cleaning composition further comprises at least one quaternary base. 3. The method of claim 1 , wherein said contacting comprises conditions selected from the group consisting of: time of from about 1 second to about 20 minutes; temperature in a range of from about 20° C. to about 90° C.; and combinations thereof. 4. The method of claim 1 , wherein the microelectronic device comprises an article selected from the group consisting of semiconductor substrates, flat panel displays, phase change memory devices, solar panels and other products including, solar substrates, photovoltaics, and microelectromechanical systems (MEMS). 5. The method of claim 1 , further comprising diluting the cleaning composition with diluent at or before a point of use, wherein the composition is diluted in a range from about 5:1 to about 200:1. 6. The method of claim 4 5, wherein said diluent comprises water. 7. The method of claim 1 , further comprising rinsing the microelectronic device with deionized water following contact with the cleaning composition. 8. The method of claim 1 , wherein the cleaning composition further comprises at least one additional component selected from the group consisting of: at least one quaternary base; at least one complexing agent; at least one surfactant; at least one reducing agent; at least one dispersing agent; at least one sulfonic acid-containing hydrocarbon; at least one alcohol; and combinations thereof. 9. The method of claim 1 , wherein the cleaning composition further comprises at least one embodiment (i) through (viii): (i) at least one quaternary base, and optionally at least one reducing agent; (ii) at least one quaternary base, and at least one complexing agent; (iii) at least one surfactant, and optionally at least one reducing agent; (iv) at least one reducing agent, optionally at least one surfactant, and optionally at least one quaternary base; (v) at least one quaternary base, at least one reducing agent, and optionally at least one surfactant; (vi) at least one quaternary base and uric acid; (vii) at least one quaternary base, uric acid, and at least one alcohol; and (viii) at least one quaternary base and at least one alcohol. 10. The method of claim 1 , wherein the solvent comprises water. 11. The method of claim 1 , wherein the pH of the cleaning composition is in a range from about 8.5 to about 11.5. 12. The method of claim 1 , wherein the cleaning composition is substantially devoid of oxidizing agent, fluoride source, and/or abrasive material prior to removal of residue material from the microelectronic device. 13. The method of claim 1 , wherein the cleaning composition further comprises at least one additional corrosion inhibitor, wherein the at least one additional corrosion inhibitor comprises a species selected from the group consisting of ascorbic acid, L(+)-ascorbic acid, isoascorbic acid, ascorbic acid derivatives, benzotriazole, citric acid, ethylenediamine, gallic acid, oxalic acid, tannic acid, ethylenediaminetetraacetic acid (EDTA), uric acid, 1,2,4-triazole (TAZ), tolyltriazole, 5-phenyl-benzotriazole, 5-nitro-benzotriazole, 3-amino-5-mercapto-1,2,4-triazole, 1-amino-1,2,4-triazole, hydroxybenzotriazole, 2-(5-amino-pentyl)-benzotriazole, 1-amino-1,2,3-triazole, 1-amino-5-methyl-1,2,3-triazole, 3-amino-1,2,4-triazole, 3-mercapto-1,2,4-triazole, 3-isopropyl-1,2,4-triazole, 5-phenylthiol-benzotriazole, halo-benzotriazoles (halo=F, Cl, Br or I), naphthotriazole, 2-mercaptobenzimidazole (MBI), 2-mercaptobenzothiazole, 4-methyl-2-phenylimidazole, 2-mercaptothiazoline, 5-aminotetrazole, 5-amino-1,3,4-thiadiazole-2-thiol, 2,4-diamino-6-methyl-1,3,5-triazine, thiazole, triazine, methyltetrazole, 1,3-dimethyl-2-imidazolidinone, 1,5-pentamethylenetetrazole, 1-phenyl-5-mercaptotetrazole, diaminomethyltriazine, imidazoline thione, mercaptobenzimidazole, 4-methyl-4H-1,2,4-triazole-3-thiol, 5-amino-1,3,4-thiadiazole-2-thiol, benzothiazole, tritolyl phosphate, imidazole, indiazole, benzoic acid, ammonium benzoate, catechol, pyrogallol, resorcinol, hydroquinone, cyanuric acid, barbituric acid and derivatives such as 1,2-dimethylbarbituric acid, alpha-keto acids such as pyruvic acid, adenine, purine, phosphonic acid and derivatives thereof, glycine/ascorbic acid, and combinations thereof. 14. The method of claim 1 , wherein the at least one amine has the general formula NR 1 R 2 R 3 , where R 1 , R 2 and R 3 may be the same as or different from one another and are selected from the group consisting of hydrogen, straight-chained C 1 -C 6 alkyl, branched C 1 -C 6 alkyl, straight-chained C 1 -C 6 alcohol, and branched C 1 -C 6 alcohol. 15. The method of claim 2 , wherein the at least one quaternary base has the formula NR 1 R 2 R 3 R 4 OH, wherein R 1 , R 2 , R 3 and R 4 may be the same as or different from one another and are selected from the group consisting of hydrogen, straight-chained C 1 -C 6 alkyl, branched C 1 -C 6 alkyl, substituted C 6 -C 10 aryl, and unsubstituted C 6 -C 10 aryl. 16. The method of claim 8 , comprising at least one alcohol, wherein the at least one alcohol comprises straight-chained or branched C 1 -C 6 alcohols. 17. The method of claim 14 , wherein the at least one amine comprises a species selected from the group consisting of aminoethyletholamine, N-methylaminoethanol, aminoethoxyethanol, dimethylaminoethoxyethanol, diethanolamine, N-methyldiethanolamine, monoethanolamine, triethanolamine, 1-amino-2-propanol, 2-amino-1-butanol, isobutanolamine, triethylenediamine, other C i -C 8 alkanolamines and combinations thereof. 18. The method of claim 15 , wherein the at least one quaternary base comprises a species selected from the group consisting of tetraethylammonium hydroxide (TEAH), tetramethyammonium hydroxide (TMAH), tetrapropylammonium hydroxide (TPAH), t

Assignees

Inventors

Classifications

  • C11D3/0084Primary

    Antioxidants; Free-radical scavengers · CPC title

  • C11D3/0073Primary

    Anticorrosion compositions · CPC title

  • containing nitrogen · CPC title

  • Chemistry & Metallurgy · mapped topic

  • Heterocyclic compounds · CPC title

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What does patent USRE46427E cover?
An cleaning composition and process for cleaning post-chemical mechanical polishing (CMP) residue and contaminants from a microelectronic device having said residue and contaminants thereon. The cleaning compositions include novel corrosion inhibitors. The composition achieves highly efficacious cleaning of the post-CMP residue and contaminant material from the surface of the microelectronic de…
Who is the assignee on this patent?
Advanced Tech Materials, Entegris Inc
What technology area does this patent fall under?
Primary CPC classification C11D3/0084. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 06 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (E1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).