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Elastic membrane for semiconductor wafer polishing apparatus

USD981969S · US · S1

Patent metadata
FieldValue
Publication numberUS-D981969-S
Application numberUS-202129794758-F
CountryUS
Kind codeS1
Filing dateJun 15, 2021
Priority dateDec 18, 2020
Publication dateMar 28, 2023
Grant dateMar 28, 2023

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CLAIM The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.

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