Bond pattern
US-2019290504-A1 · Sep 26, 2019 · US
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Bond pattern for substrate
USD1031026S · US · S1
| Field | Value |
|---|---|
| Publication number | US-D1031026-S |
| Application number | US-202229859142-F |
| Country | US |
| Kind code | S1 |
| Filing date | Nov 8, 2022 |
| Priority date | Mar 20, 2018 |
| Publication date | Jun 11, 2024 |
| Grant date | Jun 11, 2024 |
First claim
Opening claim text (preview).
CLAIM The ornamental design for the bond pattern for a substrate, as shown and described above.
Assignees
Inventors
Classifications
- A61F13/15699Primary
Forming webs by bringing together several webs, e.g. by laminating or folding several webs, with or without additional treatment of the webs · CPC title
Applying tabs, strips, tapes, loops; Knotting the ends of pads · CPC title
characterised by the absorbing medium (A61F13/20 takes precedence) · CPC title
via adhesive · CPC title
characterized by the features before use, e.g. how are the diapers folded or arranged in a package · CPC title
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