Bond pattern for substrate
US-D1076074-S · May 20, 2025 · US
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Patent family 65995897
This patent family groups 7 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 65995897 |
| Family type | — |
| Earliest priority | Mar 20, 2018 |
| First filing country | US |
| Member publications | 7 |
| Countries | US |
| Representative publication | USD1076074S — Bond pattern for substrate |
Representative publication
Best representative member for this family based on priority and filing country.
USD1076074S — Bond pattern for substrate (published May 20, 2025)
Member publications
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