System and method to monitor semiconductor workpiece temperature using thermal imaging

Patent metadata

Field	Value
Publication number	US-9995631-B2
Application number	US-201615239350-A
Country	US
Kind code	B2
Filing date	Aug 17, 2016
Priority date	Jun 10, 2016
Publication date	Jun 12, 2018
Grant date	Jun 12, 2018

Abstract

An improved system for measuring the temperature of a plurality of workpieces in a rotating semiconductor processing device is disclosed. Because silicon has variable emissivity in the infrared band, a temperature stable, high emissivity coating is applied to a portion of the workpiece, allowing the temperature of the workpiece to be measured by observing the temperature of the coating. Further, by limiting the amount of coating applied to the workpiece, the effect of the coating on the intrinsic temperature of the workpiece and the surrounding semiconductor processing device may be minimized. The temperature of the workpieces is measured as the workpieces pass under an aperture by capturing a thermal image of a portion of the workpiece. In certain embodiments, a controller is used to process the plurality of thermal images into a single thermal image showing all of the workpieces disposed within the semiconductor processing device.

First claim

What is claimed is:

1. An apparatus for capturing a thermal image of a workpiece, comprising:
a workpiece processing device having a process chamber and an observation window;
a workpiece disposed in the workpiece processing device, the workpiece having a coating disposed on a portion of a surface;
an infrared camera disposed outside the process chamber and adapted to capture thermal images of the workpiece in the workpiece processing device through the observation window; and
a controller, in communication with the infrared camera, wherein the infrared camera captures a plurality of thermal images of the workpiece, and transmits the plurality of thermal images to the controller; and
wherein the controller assembles the plurality of thermal images into a single complete thermal image showing an entirety of the workpiece.

2. The apparatus of claim 1 , wherein the workpiece processing device comprises a rotating plate on which the workpiece is disposed, such that the workpiece moves relative to the infrared camera, and the thermal images each capture a portion of the workpiece, less than an entirety of the workpiece.

3. The apparatus of claim 2 , wherein the workpiece processing device comprises a baseplate disposed between the rotating plate and the infrared camera, the baseplate having an aperture therein such that only the portion of the workpiece disposed beneath the aperture is visible to the infrared camera.

4. The apparatus of claim 3 , further comprising a light blocking structure, having an open base and a top surface with a viewing aperture, the light blocking structure disposed in the process chamber with the base of the light blocking structure disposed on the aperture in the baseplate, and the infrared camera positioned so that an optical axis of the infrared camera passes through the viewing aperture.

5. The apparatus of claim 4 , wherein a light trap is disposed on an interior surface of the light blocking structure.

6. The apparatus of claim 4 , wherein the viewing aperture comprises a material transparent to infrared light, and the viewing aperture is not orthogonal to the optical axis of the infrared camera.

7. An apparatus for capturing a thermal image of a workpiece, comprising:
a workpiece processing device having a process chamber, the process chamber defined by a lid and a baseplate;
the baseplate having an aperture therein, the aperture configured to be smaller than a workpiece;
a rotating plate disposed beneath the baseplate;
a workpiece disposed on the rotating plate, the workpiece having a coating disposed on a portion of a surface;
an infrared camera disposed outside the process chamber and adapted to capture thermal images of the workpiece through an observation window in the lid, wherein an optical axis of the infrared camera passes through the observation window and the aperture in the baseplate; and
a controller, in communication with the infrared camera, wherein the infrared camera captures a plurality of thermal images of the workpiece as the workpiece moves on the rotating plate, and transmits the plurality of thermal images to the controller; and
wherein the controller assembles the plurality of thermal images into a single complete thermal image showing an entirety of the workpiece.

8. The apparatus of claim 7 , further comprising a light blocking structure, having an open base and a top surface with a viewing aperture, the light blocking structure disposed in the process chamber with the base of the light blocking structure disposed on the aperture in the baseplate, and the infrared camera positioned so that the optical axis of the infrared camera passes through the viewing aperture.

9. The apparatus of claim 8 , wherein the viewing aperture comprises a material transparent to infrared light, and the viewing aperture is not orthogonal to the optical axis of the infrared camera.

10. The apparatus of claim 8 , wherein an inside surface of the light blocking structure is coated with a low emissivity coating.

11. The apparatus of claim 8 , wherein the light blocking structure comprises a plurality of walls constructed of a material that do not permit passage of infrared light.

12. The apparatus of claim 8 , wherein a light trap is disposed on an interior surface of the light blocking structure.

13. The apparatus of claim 12 , wherein the light trap comprises a plurality of low emissivity members and surfaces arranged in parallel and attached to an interior surface of a side of the light blocking structure.

14. The apparatus of claim 7 , wherein the rotating plate holds a plurality of workpieces, and the controller creates a complete thermal image showing all of the plurality of workpieces disposed on the rotating plate.

15. The apparatus of claim 7 , wherein the coating covers less than 20% of a total surface of the workpiece.

16. A temperature measurement system, comprising:
an infrared camera;
a rotating plate to hold a workpiece, the workpiece having a coating disposed on a portion of the workpiece, less than an entirety of the workpiece, wherein the workpiece moves relative to the infrared camera; and
a controller in communication with the infrared camera, wherein the infrared camera captures a plurality of thermal images of the workpiece, where each thermal image captures less than an entirety of the workpiece, and transmits the plurality of thermal images to the controller; and
wherein the controller assembles the plurality of thermal images into a single complete thermal image showing an entirety of the workpiece.

17. The temperature measurement system of claim 16 , wherein position information of the rotating plate is associated with each of the plurality of thermal images and the controller uses the position information to create the single complete thermal image.

18. The temperature measurement system of claim 16 , wherein time information is associated with each of the plurality of thermal images and the controller uses the time information to create the single complete thermal image.

19. The temperature measurement system of claim 16 , wherein adjacent thermal images have an overlapping portion, and the controller uses image matching to create the single complete thermal image.

20. The temperature measurement system of claim 16 , wherein the coating covers less than 20% of a total surface of the workpiece.

Assignees

• Varian Semiconductor Equipment Ass Inc

Inventors

• Pergande Paul E
• Wyka Gary E
• Webb Aaron

Classifications

• G01J2005/065

  by shielding · CPC title

• G01J5/047

  Mobile mounting; Scanning arrangements · CPC title

• G01J5/025

  Interfacing a pyrometer to an external device or network; User interface · CPC title

• G01J5/06

  Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity (for adjusting of solid angle of collected radiation G01J5/07; means for wavelength selection G01J5/0801) · CPC title

• G01J5/0205

  Mechanical elements; Supports for optical elements · CPC title