Polishing composition

US9994748B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9994748-B2
Application numberUS-201414910839-A
CountryUS
Kind codeB2
Filing dateJul 17, 2014
Priority dateAug 9, 2013
Publication dateJun 12, 2018
Grant dateJun 12, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

[Problem] An object is to provide a polishing composition which can improve smoothness of a surface of an alloy material to obtain a highly glossy surface, and can obtain a high-quality mirror surface having significantly reduced scratches or the like. [Solution] There is provided a polishing composition which is used for polishing an alloy material, and which comprises abrasive grains and an additive which does not form a complex with specific metal species and is adsorbed on a surface of the alloy to exhibit an anticorrosive effect.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polishing method for polishing an alloy material using a polishing composition wherein the polishing composition comprises: abrasive grains; and an additive which does not form a complex with specific metal species and is adsorbed on a surface of the alloy to exhibit an anticorrosive effect and the additive is represented by the following formula (I): Z—O-(AO) n H  (I), wherein Z is a hydrophobic portion, and the hydrophobic portion is a substituted or unsubstituted alkyl group or aryl group having a carbon number of 5 or more and 15 or less, A is an alkylene group having a carbon number of 1 or more and 3 or less, n is an integer of 1 or more and 50 or less and wherein a main component of the alloy material is at least one member selected from the group consisting of aluminum, titanium, iron, nickel, and copper. 2. The polishing method for polishing an alloy material according to claim 1 , wherein the abrasive grains are made of silica. 3. The polishing method for polishing an alloy material according to claim 1 , wherein an average aspect ratio of primary particles of the abrasive grains is 1.10 or more. 4. The polishing method for polishing an alloy material according to claim 1 , wherein the main component of the alloy material is at least one member selected from the group consisting of aluminum, iron, and nickel. 5. The polishing method for polishing an alloy material according to claim 1 , wherein the main component of the alloy material is aluminum. 6. The polishing method for polishing an alloy material according to claim 1 , wherein the main component of the alloy material is aluminum, and comprises at least one member of metal element selected from the group consisting of silicon, magnesium, iron, copper, and zinc at a content of 0.5% by mass or more and 20% by mass or less with respect to a total amount of the alloy material. 7. A method for manufacturing an alloy material, comprising a step of polishing by the polishing method according to claim 1 .

Assignees

Inventors

Classifications

  • the coating consisting exclusively of metals · CPC title

  • C09K3/1436Primary

    Composite particles, e.g. coated particles · CPC title

  • containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} · CPC title

  • B24B37/00Primary

    Lapping machines or devices; Accessories (B24B3/00 takes precedence) · CPC title

  • Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes · CPC title

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Frequently asked questions

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What does patent US9994748B2 cover?
[Problem] An object is to provide a polishing composition which can improve smoothness of a surface of an alloy material to obtain a highly glossy surface, and can obtain a high-quality mirror surface having significantly reduced scratches or the like. [Solution] There is provided a polishing composition which is used for polishing an alloy material, and which comprises abrasive grains an…
Who is the assignee on this patent?
Fujimi Inc
What technology area does this patent fall under?
Primary CPC classification C09K3/1436. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 12 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).