Enhanced adhesive materials and processes for 3D applications

Patent metadata

Field	Value
Publication number	US-9994741-B2
Application number	US-201514967353-A
Country	US
Kind code	B2
Filing date	Dec 13, 2015
Priority date	Dec 13, 2015
Publication date	Jun 12, 2018
Grant date	Jun 12, 2018

Abstract

The present invention relates to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.

First claim

What we claim and desire to protect by Letters Patent is:

1. A polymer based composite adhesive suitable for bonding metal interconnects in a three-dimensional integrated circuit (3DI) and four-dimensional integrated circuit (4DI) microelectronic article structures comprising:
a polymer/carbon nanotube (CNT) composite adhesive structure comprising a polymer base resin matrix, said polymer base resin matrix being selected from the group consisting of polyimides, polybenzazole, polybenzoxazoles, polyimidazoles, polybenzimidazoles, polyarylenes, polyarylene ethers, polyetheretherketones, polyarylether ketones and polynorbornenes, and being compatible with a copper metal contact pad, and said polymer base resin matrix having high thermal conductivity and a temperature stability of at least 350° C., in admixture with:
a plurality of carbon nanotubes (CNT), said CNTs being directionally aligned, having length of between about 1 μm and 30 μm, a density of between about 10 +10 and 10 +11 nanostructures/cm 2 , embedded within said copper compatible polymer adhesive matrix and present between at least two laminates in said 3DI and 4DI structures, wherein, in order achieve an optimum level of bond strength and thermal conductivity, having a loading level of said CNT in said polymer base resin matrix, that ranges from about 30% by volume to about 80% by volume, a specific length scale of said CNTs being substantially equal to a final bonded adhesive layer thickness so as to maximize said CNT's straddling an adhesive bond line with said specific length scale of said CNT;
said polymer based composite adhesive bonding at least one said laminated structure comprises CNTs substantially perpendicular to mating surfaces of said laminates extending a full length of a thickness of said polymer based composite adhesive on said laminated structure;
said polymer based composite adhesive containing an adhesion promoting coupling agent comprising between about 0.1% and about 1.0% of said adhesion promoting coupling agent and being selected from the group consisting of:
(3-aminopropyl) triethoxysilane, aminophenyltrimethoxysilane,
3-[2-(2-aminoethylamino)ethylamino]propyl-trimethoxysilane,
4-Ti[2-propanolato-tris(3,6-diaza)]hexanolato, methacryloxy-propyl-trimethoxysilane,
vinyl 1-trimethoxysilane, 3-Isocyanate-propyl-triexthoxysilane,
mercapto-propyltrimethoxysilane, 3-Amino-propyl-triethoxysilane and
3-methacryloxy-propyl-trimethoxysilane.

2. The polymer based composite adhesive defined in claim 1 wherein the polybenzazoles are polybenzoxazoles (PBO) and polybenzimidazoles (PBI).

3. The polymer based composite adhesive defined in claim 1 wherein said polymer based adhesive is used as a temporary adhesive and a permanent adhesive.

4. The polymer based composite adhesive defined in claim 1 wherein said CNT's are grown in situ on at least one sublaminate with a vertical growth orientation.

5. The polymer based composite adhesive defined in claim 1 wherein said length of said CNT is between about 5 μm and 10 μm.

Assignees

• Hedrick James L
• Miller Robert Dennis
• Neumayer Deborah Ann
• Purushothaman Sampath
• Rothwell Mary E
• Volksen Willi
• Yu Roy R
• IBM

Inventors

• Hedrick James L
• Miller Robert Dennis
• Neumayer Deborah Ann
• Purushothaman Sampath
• Rothwell Mary E
• Volksen Willi
• Yu Roy R

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W20/0245

  comprising use of blind vias during the manufacture · CPC title

• H10W20/0234

  comprising etching via holes that stop on pads or on electrodes · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title