Thin film transition metal dichalcogenides and methods

US9991390B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9991390-B2
Application numberUS-201514871277-A
CountryUS
Kind codeB2
Filing dateSep 30, 2015
Priority dateSep 30, 2014
Publication dateJun 5, 2018
Grant dateJun 5, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A coated substrate including a thin film of a transition metal dichalcogenide and associated methods are shown. In one example, the substrate is a semiconductor wafer. In one example, the thin film is atomically thin, and the substrate is a number of centimeters in diameter. In one example a crystalline structure of the thin film is substantially 2H hexagonal.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus, comprising: a semiconductor wafer; and an atomically thin MoS 2 layer covering the semiconductor wafer, wherein the MoS 2 layer is a 2H crystal structure with an average grain size of 25.9+/−14.7 nm, wherein the MoS 2 layer has a band gap of approximately 1.84 eV. 2. The apparatus of claim 1 , further including an optoelectronic device formed on the semiconductor wafer. 3. The apparatus of claim 1 , wherein the MoS 2 layer is two monolayers thick. 4. An electronic device, comprising: a first circuit; a second circuit coupled to the first circuit, wherein the second circuit includes: a semiconductor substrate; and an atomically thin MoS 2 layer covering at least a portion of the semiconductor substrate, wherein the MoS 2 layer is a 2H crystal structure with an average grain size of 25.9+/−14.7 nm, wherein the MoS 2 layer has a band gap of approximately 1.84 eV. 5. The electronic device of claim 4 , wherein the second circuit includes an optoelectronic device.

Assignees

Inventors

Classifications

  • Controlling the interface between substrate and epitaxial layer, e.g. by ion implantation followed by annealing · CPC title

  • being chalcogenide semiconductor materials not being oxides, e.g. ternary compounds · CPC title

  • Crystal orientation · CPC title

  • Monolayers · CPC title

  • being chalcogenide semiconducting materials not being oxides, e.g. ternary compounds · CPC title

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What does patent US9991390B2 cover?
A coated substrate including a thin film of a transition metal dichalcogenide and associated methods are shown. In one example, the substrate is a semiconductor wafer. In one example, the thin film is atomically thin, and the substrate is a number of centimeters in diameter. In one example a crystalline structure of the thin film is substantially 2H hexagonal.
Who is the assignee on this patent?
Univ California
What technology area does this patent fall under?
Primary CPC classification H01L29/78681. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 05 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).