Heating element for SMD mounting

Patent metadata

Field	Value
Publication number	US-9986648-B2
Application number	US-201615561338-A
Country	US
Kind code	B2
Filing date	Mar 29, 2016
Priority date	Mar 31, 2015
Publication date	May 29, 2018
Grant date	May 29, 2018

Abstract

The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T 1 .

First claim

What is claimed is:

1. A heating element comprising:
a mounting side for SMD mounting;
a housing enclosing a cavity; and
a reactive substance in the cavity that reacts exothermically at a reaction temperature T 1 .

2. The heating element as claimed in claim 1 , wherein the reactive substance comprises a metal-carbonyl compound.

3. The heating element as claimed in claim 1 , wherein the reactive substance comprises a mixture of a first substance and a second substance;
wherein the two substances react exothermically with oxygen independently of one another.

4. The heating element as claimed in claim 1 , further comprising an oxidizing agent admixed with the reactive substance, the oxidizing agent giving off oxygen at said reaction temperature T 1 .

5. The heating element as claimed in claim 1 , further comprising an opening connecting the cavity to surroundings of the heating element.

6. The heating element as claimed in claim 5 , further comprising an open-pore matrix material; and
wherein the reactive substance is distributed throughout the open-pore matrix material.

7. The heating element as claimed in claim 1 , further comprising a fastening device on the housing for mounting on the electronic assembly.

8. The heating element as claimed in claim 7 , wherein the fastening device comprises a pin protruding from the mounting side of the heating element.

9. The heating element as claimed in claim 8 , wherein the cavity with the reactive substance extends into the pin.

10. An electronic assembly comprising:
a circuit carrier;
a component; and
a fastened on the electronic assembly, the heating element comprising:
a mounting side for SMD mounting;
a housing enclosing a cavity; and
a reactive substance in the cavity that reacts exothermically at a reaction temperature T 1 .

11. The electronic assembly as claimed in claim 10 , further comprising the heating element fastened on the circuit carrier alongside the component.

12. The electronic assembly as claimed in claim 11 , wherein the circuit carrier comprises a sheet;
the component is mounted on a front side of the sheet; and
the heating element is mounted on a rear side of the sheet opposite from the component.

13. The electronic assembly as claimed in claim 10 , further comprising a conducting path in contact with the heating element;
the conducting path conducting heat better than the circuit carrier and in contact with the contacts to be formed or the component.

14. The electronic assembly as claimed in claim 13 , wherein the conducting path comprises electrically conductive conductor tracks for contacting the electrical contacts.

15. A method for producing an electronic assembly with a circuit carrier and a component, the method comprising:
placing the component on the circuit carrier;
fastening a heating element on the electronic assembly;
wherein the heating element includes a reactive substance reacting exothermically at a reaction temperature T 1 in a cavity of the heating element;
transferring a heat of reaction from the exothermic reaction from the heating element to the electrical contacts; and
forming electrical contacts between the circuit carrier and the component by increasing a temperature to a joining temperature T 3 ;

wherein the reaction temperature T 1 is less than the joining temperature T 3 .

16. The method as claimed in claim 15 , further comprising, after the forming of the electrical contacts, removing the heating element from the electronic assembly.

17. The method as claimed in claim 15 , further comprising using the heating element to heat up the electronic assembly locally at a point where the component is intended to replace a defective component.

18. The method as claimed in claim 15 , further comprising generating the increase in temperature in a soldering furnace.

19. The method as claimed in claim 18 , further comprising using the heating element on the circuit carrier at a point of the electronic assembly that undergoes a lower increase in temperature in the soldering furnace than other points of the electronic assembly.

Assignees

• Siemens Ag
• Kleb Und Giebharztechnik Dr Ludeck Gmbh
• Kleb Und Giessharztechnik Dr Ludeck Gmbh

Inventors

• Hanisch Michael
• Huth Heiko
• Ludeck Wolfgang
• Mueller Bernd
• Nowottnick Mathias
• Prihodovsky Andrey
• Seehase Dirk
• Wittreich Ulrich
• Wormuth Dirk

Classifications

• H05K2203/1163

  Chemical reaction, e.g. heating solder by exothermic reaction · CPC title

• B23K1/0006 Primary

  Exothermic brazing · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title

• B23K2101/42

  Printed circuits · CPC title