Wireless communications package with integrated antennas and air cavity

Patent metadata

Field	Value
Publication number	US-9985346-B2
Application number	US-201715404182-A
Country	US
Kind code	B2
Filing date	Jan 11, 2017
Priority date	Aug 13, 2014
Publication date	May 29, 2018
Grant date	May 29, 2018

Abstract

Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.

First claim

We claim:

1. An antenna package, comprising:
a package carrier comprising an antenna ground plane and an antenna feed line; and
a package cover comprising a planar lid, the planar lid comprising a planar antenna element formed on a first surface of the planar lid;
wherein the package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element on the first surface of the planar lid aligned to the antenna ground plane and the antenna feed line of the package carrier;
wherein the package cover is bonded to the package carrier with the first surface of the planar lid fixedly disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the first surface of the package carrier; and
wherein the package cover comprises a rectangular frame structure that is bonded to the planar lid using a first array of solder bump connections, and wherein the rectangular frame structure is bonded to the first surface of the package carrier using a second array of solder hump connections.

2. The antenna package of claim 1 , wherein the antenna ground plane comprises a slot formed therein, wherein the slot is aligned to the planar antenna element and to a portion of the antenna feed line, wherein the slot is configured to couple electromagnetic energy between the planar antenna element and the antenna feed line.

3. The antenna package of claim 1 , wherein the antenna ground plane is disposed on the first surface of the package carrier.

4. The antenna package of claim 1 , wherein a portion of the antenna feed line is disposed on the first surface of the package carrier.

5. The antenna package of claim 1 , wherein the planar lid comprises an array of patch antenna elements formed on the first surface of the package lid.

6. The antenna package of claim 1 , further comprising one or more support structures disposed in the air space between the first surfaces of the planar lid and package carrier to support the planar lid.

7. The antenna package of claim 1 , further comprising a metallization pattern formed on a second surface of the planar lid, opposite the first surface of the planar lid, wherein the metallization pattern is configured to provide structural support to the planar lid.

8. The antenna package of claim 1 , wherein each antenna ground plane comprises a slot formed therein, wherein the slot is aligned to a corresponding planar antenna element and to end portions of the first and second antenna feed lines associated with the corresponding planar antenna element, wherein the slot is configured to couple electromagnetic energy between the planar antenna element and the end portion of the first antenna feed line.

9. The antenna package of claim 8 , wherein the antenna ground plane is disposed within the package carrier between the end portions of the first and second antenna feed lines.

10. The antenna package of claim 9 , wherein the end portion of the second antenna feed line is disposed on the first surface of the package carrier.

11. A wireless communications package comprising:
an antenna package, comprising:
a package carrier comprising an antenna ground plane and an antenna feed line; and
a package cover comprising a planar lid, the planar lid comprising a planar antenna element formed on a first surface of the planar lid;
wherein the package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the - first surface of the package carrier, and with the planar antenna element on the first surface of the planar lid aligned to the antenna ground plane and the antenna feed line of the package carrier;
wherein the package cover is bonded to the package carrier with the first surface of the planar lid fixedly disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the first surface of the package carrier; and
wherein the package cover comprises a rectangular frame structure that is bonded to the planar lid using a first array of solder bump connections, and wherein the rectangular frame structure is bonded to the first surface of the package carrier using a second array of solder bump connections; and

an RFIC (radio frequency integrated circuit) chip flip-chip bonded to a second surface of the package carrier opposite the first surface of the package carrier.

12. The wireless communications package of claim 11 , further comprising an application board bonded to the second surface of the package carrier.

13. The wireless communications package of claim 11 , further comprising one or more support structures disposed in the air space between the first surfaces of the planar lid and package carrier to support the planar lid.

14. The wireless communications package of claim 11 , further comprising a metallization pattern formed on a second surface of the planar lid, opposite the first surface of the planar lid, wherein the metallization pattern is configured to provide structural support to the planar lid.

15. An antenna package, comprising:
a package carrier comprising a plurality of antenna ground planes, and a plurality of antenna feed lines; and
a package cover comprising a planar lid, wherein the planar lid comprises a planar antenna array patterned on a first surface of the planar lid, wherein the planar antenna array comprises an array of planar antenna elements;
wherein the package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, wherein each planar antenna element on the first surface of the planar lid is aligned to a corresponding one of the antenna ground planes and a corresponding one of the antenna feed lines;
wherein each antenna feed line comprises a first antenna feed line and a second antenna feed line, wherein the first and second antenna feed lines enable a dual polarization mode of operation of the planar antenna elements; and
wherein the package cover is bonded to the package carrier with the first surface of the planar lid fixedly disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna array and the first surface of the package carrier.

16. The antenna package of claim 15 , wherein the package cover comprises a sidewall structure disposed around a peripheral region of the first surface of the planar lid, wherein the sidewall structure is bonded to the first surface of the package carrier.

17. The antenna package of claim 16 , wherein the package cover is bonded to the first surface of the package carrier using an array of solder bump connections between the sidewall structure and the package carrier.

18. The antenna package of claim 16 , wherein the package cover is bonded to the first surface of the package carrier using an adhesive material between the sidewall structure and the package carrier.

19. The antenna package of claim 15 , wherein the first surface of the planar lid is bonded to the first surface of the package carrier using a ball grid array of solder connections.

20. The antenna package of claim 15 , wherein the package cover comprises a rectangular frame structure that is bonded to the planar lid using a first array of solder bump connections, and wherein the rectangular frame structure is bonded to the first surface of

Assignees

• IBM

Inventors

• Baks Christian Wilhelmus
• Gu Xiaoxiong
• Liu Duixian
• Valdes-Garcia Alberto

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W44/248

  for antennas · CPC title