Solar Cell and Method of Manufacturing Same, and Solar Cell Module
US-2015372169-A1 · Dec 24, 2015 · US
US9985162B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9985162-B2 |
| Application number | US-201113216109-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 23, 2011 |
| Priority date | Aug 25, 2010 |
| Publication date | May 29, 2018 |
| Grant date | May 29, 2018 |
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A solar cell includes a substrate containing a first impurity of a first conductivity type and made of a crystalline semiconductor, an emitter region positioned on the substrate and containing a second impurity of a second conductivity type different from the first conductivity type, the emitter region being made of a non-crystalline semiconductor, a surface field region positioned on the substrate and containing a third impurity of the first conductivity type, the surface field region being made of non-crystalline semiconductor, a first electrode connected to the emitter region, and a second electrode connected to the surface field region, wherein at least one of the emitter region and the surface field region is made of amorphous metal silicide containing a metal material.
Opening claim text (preview).
What is claimed is: 1. A solar cell, comprising: a substrate containing a first impurity of a first conductivity type and made of a crystalline semiconductor; an emitter region positioned on the substrate and containing a second impurity of a second conductivity type different from the first conductivity type, the emitter region forming a heterojunction with the substrate; an anti-reflection layer physically directly contacting the emitter region; a surface field region positioned on the substrate and containing a third impurity of the first conductivity type, the surface field region forming a heterojunction with the substrate; a first electrode passing through the anti-reflection layer and physically directly contacting the emitter region; and a second electrode physically directly contacting the surface field region, wherein at least one of the emitter region and the surface field region comprises an amorphous metal silicide layer containing a metal material comprising at least one of chromium (Cr), aluminum (Al), cobalt (Co), hafnium (Hf), molybdenum (Mo), nickel (Ni), lead (Pd), platinum (Pt), tantalum (Ta), titanium (Ti), tungsten (W), and zirconium (Zr), wherein a concentration of the metal material contained in the at least one of the emitter region and the surface field region is 1×10 15 atoms/cm 2 to 1×10 21 atoms/cm 2 , wherein the at least one of the emitter region and the surface field region comprises a first portion directly contacting the substrate and made of amorphous silicon configured to perform a passivation function and a second portion positioned on the first portion and made of the amorphous metal silicide layer configured to improve a transfer efficiency of charges, wherein the first and second portions are doped with the second impurity or the third impurity, and wherein the impurity doped concentrations of the first and second portions are 1×10 16 atoms/cm 3 to 1×10 21 atoms/cm 3 . 2. The solar cell of claim 1 , wherein the at least one of the emitter region and the surface field region has a resistance of 1×10 −6 to 1×10 −3 Ω-cm. 3. The solar cell of claim 1 , wherein the first impurity is the same as the third impurity. 4. The solar cell of claim 1 , wherein the first impurity is different from the third impurity. 5. The solar cell of claim 1 , wherein the emitter region is positioned on an incident surface of the substrate, on which light is incident. 6. The solar cell of claim 5 , wherein the surface field region is positioned on a surface of the substrate, which is opposite the incident surface of the substrate. 7. The solar cell of claim 1 , wherein impurity doped concentrations of the first and second portions in a unit volume are equal to each other. 8. A solar cell, comprising: a substrate having a first conductivity type and made of a crystalline semiconductor; an emitter region positioned on the substrate and having a second conductivity type different from the first conductivity type, the emitter region forming a heterojunction with the substrate; an anti-reflection layer physically directly contacting the emitter region; a surface field region positioned on the substrate and having the first conductivity type, the surface field region forming a heterojunction with the substrate; a first electrode passing through the anti-reflection layer and physically contacting the emitter region; and a second electrode physically directly contacting the surface field region, wherein at least one of the emitter region and the surface field region comprises an amorphous metal silicide layer containing a metal material comprising at least one of chromium (Cr), aluminum (Al), cobalt (Co), hafnium (Hf), molybdenum (Mo), nickel (Ni), lead (Pd), platinum (Pt), tantalum (Ta), titanium (Ti), tungsten (W), and zirconium (Zr), wherein a concentration of the metal material contained in the at least one of the emitter region and the surface field region is 1×10 15 atoms/cm 2 to 1×10 21 atoms/cm 2 , wherein the at least one of the emitter region and the surface field region comprises a first portion directly contacting the substrate and made of amorphous silicon configured to perform a passivation function and a second portion positioned on the first portion and made of the amorphous metal silicide layer configured to improve a transfer efficiency of charges, wherein the first and second portions are doped with an impurity, and wherein the impurity doped concentrations of the first and second portions are 1×10 16 atoms/cm 3 to 1×10 21 atoms/cm 3 .
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