Power MOSFET current sense structure and method
US-9293535-B2 · Mar 22, 2016 · US
US9983239B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9983239-B2 |
| Application number | US-201615154702-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 13, 2016 |
| Priority date | May 13, 2016 |
| Publication date | May 29, 2018 |
| Grant date | May 29, 2018 |
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An integrated circuit (IC) for sensing a current flowing through a transistor device includes a substrate and a current scaling circuit that includes first and second MOSFET devices. The first MOSFET device has a drain coupled to the switched FET at a first node and a source coupled to the substrate. The second MOSFET device has a source coupled to the substrate and a drain coupled to a second node. The first MOSFET device has a channel size that is K times larger than the second MOSFET device. Circuitry is included that equalizes a voltage across both the first MOSFET device and the second MOSFET device.
Opening claim text (preview).
I claim: 1. An integrated circuit (IC) for sensing a main current flowing through a transistor device, the IC comprising: a substrate; a current scaling circuit that includes first and second MOSFET devices, the first MOSFET device having a drain coupled to the transistor device at a first node and a source coupled to the substrate, the second MOSFET device having a source coupled to the substrate and a drain coupled to a second node, the first and second MOSFET devices each have a gate that is commonly coupled to receive a gate drive signal, the first MOSFET device having a channel size that is K times larger, where K is an integer greater than 1, as compared to the second MOSFET device, thereby producing a current ratio of K:1 between the first and second MOSFET devices in operation; and circuitry coupled to the first and second nodes which equalizes a voltage across both the first MOSFET device and the second MOSFET device. 2. The IC of claim 1 further comprising a current mirror having a first side coupled to the second node, and a second side, a secondary current flowing through the first side and a sense current flowing through the second side of the current mirror. 3. The IC of claim 1 wherein the sources of the first and second MOSFET devices are connected directly to the substrate. 4. The IC of claim 1 wherein the circuitry comprises an equalizer circuit having a first input coupled to the first node and a second input coupled to the second node, the equalizer circuit outputting an equalizer signal in response to a voltage difference across the first and second inputs. 5. The IC of claim 4 wherein the circuitry further comprises a modulator circuit coupled to receive the equalizer signal and, responsive to the equalizer signal, modulate a secondary current flowing through the second MOSFET device to equalize the voltage across both the first MOSFET device and the second MOSFET device. 6. The IC of claim 2 wherein the first side of the current mirror includes a first PMOS transistor coupled between a voltage supply and the second node, the second side of the current mirror includes a second PMOS transistor coupled to the voltage supply, the first and second PMOS transistors each having a gate commonly coupled to the second node. 7. The IC of claim 6 wherein the first PMOS transistor has a size that is M times larger, where M is an integer greater than or equal to 1, as compared to the second PMOS transistor, thereby producing a current ratio of M:1 between the first and second PMOS transistors in operation. 8. The IC of claim 7 wherein a total ratio of the main current to the sense current is (K×M):1. 9. The IC of claim 2 wherein the current mirror further comprises one or more additional cascoded current mirror stages. 10. The IC of claim 4 wherein the equalizer circuit comprises an operational amplifier. 11. The IC of claim 5 wherein the modulator circuit comprises a second transistor device coupled to the second node. 12. The IC of claim 11 wherein the second transistor device is a MOSFET that operates in a linear mode. 13. The IC of claim 11 wherein the second transistor device is a bipolar junction transistor (BJT) that operates in a linear mode. 14. The IC of claim 12 wherein the modulator circuit further includes a resistor having one end connected to the gate of the MOSFET and another end coupled to receive the equalizing signal. 15. The IC of claim 1 wherein the transistor device comprises a gallium nitride (GaN) high electron mobility FET (HEMFET). 16. The IC of claim 1 further comprising a current sense component coupled to receive the sense current. 17. The IC of claim 4 wherein the circuitry further comprises a high-voltage blocker circuit coupled between the first node and the first input of the equalizer circuit. 18. The IC of claim 17 wherein the high-voltage blocker circuit comprises a normally-ON high voltage JFET. 19. The IC of claim 17 wherein the first and second MOSFET devices are monolithic devices having substantially the same characteristic parameters. 20. The IC of claim 7 wherein M is an integer greater than 1.
Measuring current only · CPC title
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Nitride Group III-V materials, e.g. AlN or GaN · CPC title
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