Photocurable composition and method of manufacturing film using the composition

Patent metadata

Field	Value
Publication number	US-9982102-B2
Application number	US-201314405929-A
Country	US
Kind code	B2
Filing date	Sep 11, 2013
Priority date	Sep 19, 2012
Publication date	May 29, 2018
Grant date	May 29, 2018

Abstract

Provided are a photocurable composition having high filling property and capable of reducing a mold release force upon production of a film through the utilization of a photo-imprint method, and a method of manufacturing a film using the photocurable composition. The photocurable composition is a photocurable composition, including at least the following component (A) to component (C): (A) a polymerizable compound; (B) a photopolymerization initiator; and (C) a surfactant represented by the following general formula (1):

Rf 1 -Rc-X.  (1)

First claim

The invention claimed is:

1. A method of manufacturing a film, comprising:
a placing step of placing a photocurable composition on a substrate;
a mold contact step of bringing the photocurable composition and a mold into contact with each other;
a light irradiation step of irradiating the photocurable composition with light;
a mold release step of releasing a cured product of the photocurable composition and the mold from each other after the light irradiation step; and
a residual film removal step of removing a film remaining in a recessed portion of the cured product by etching after the mold release step to expose a surface of the substrate,
wherein the photocurable composition comprises:
a polymerizable compound, wherein the polymerizable compound comprises (2-methyl-2-ethyl-1,3-dioxolan-4-yl)methyl acrylate and at least one selected from the group consisting of isobornyl acrylate and hexanediol diacrylate;
a photopolymerization initiator; and
a surfactant represented by one of the general formulae (2) and (3):

wherein, in the general formula (2) and (3), n represents an integer of 1 or more.

2. The method according to claim 1 , wherein a surface of the mold in contact with the photocurable composition comprises quartz.

3. The method according to claim 1 , wherein:
the light irradiation step comprises irradiating the photocurable composition with light through the mold; and
the mold has concavo-convex pattern on a surface thereof.

4. A method of manufacturing a substrate with a circuit, comprising performing one of etching and ion implantation based on a pattern shape of a film obtained by the method according to claim 1 to form a circuit structure on the substrate based on the pattern shape.

5. An optical member, comprising:
a substrate; and
a film placed on the substrate,
wherein the film comprises a film manufactured by the method according to claim 1 .

6. The method according to claim 1 , wherein the photocurable composition has a surface tension at 23° C. of 5 mN/m to 70 mN/m in a mixture of components except a solvent.

7. The method according to claim 1 , wherein the photopolymerization initiator is a photoradical generator.

8. The method according to claim 1 , wherein the placing step comprises placing the photocurable composition on the substrate by an ink jet method.

9. The method according to claim 1 , wherein the polymerization initiator comprises 2,2-dimethoxy-2-phenylacetophenone.

10. A film manufactured by the method according to claim 1 , wherein a surface of the film has a water contact angle of 74° or less.

Assignees

• Canon Kk

Inventors

• Ito Toshiki
• Mihara Chieko
• Kawasaki Youji

Classifications

• H10P50/695

  characterised by the process involved to create the mask, e.g. lift-off masks or sidewalls or to modify the mask · CPC title

• H10P50/28

  of insulating materials · CPC title

• H10P14/683

  carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC · CPC title

• H05K3/06

  the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K3/108)} · CPC title

• C08F2/48 Primary

  by ultraviolet or visible light · CPC title