Copper foil composite, formed product and method of producing the same

Patent metadata

Field	Value
Publication number	US-9981450-B2
Application number	US-201214369891-A
Country	US
Kind code	B2
Filing date	Jan 13, 2012
Priority date	Jan 13, 2012
Publication date	May 29, 2018
Grant date	May 29, 2018

Abstract

A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f 3 ×t 3 )/(f 2 ×t 2 )=>1 wherein t 2 (mm) is a thickness of the copper foil, f 2 (MPa) is a stress of the copper foil under tensile strain of 4%, t 3 (mm) is a thickness of the resin layer, f 3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1<=33f 1 /(F×T) wherein f 1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Sn layer having a thickness of 0.2 to 3.0 μm is formed on a surface of the copper foil on which the resin layer is not laminated.

First claim

What is claimed is:

1. A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f 3 ×t 3 )/(f 2 ×t 2 )≥1 wherein t 2 is a thickness of the copper foil measured in mm, f 2 is a stress of the copper foil measured in MPa under tensile strain of 4%, t 3 is a thickness of the resin layer measured in mm, f 3 is a stress of the resin layer measured in MPa under tensile strain of 4%, and an equation 2:1≤33f 1 /(F×T) wherein f 1 is 180° peeling strength between the copper foil and the resin layer measured in N/mm, F is strength of the copper foil composite measured in MPa under tensile strain of 30%, and T is a thickness of the copper foil composite measured in mm, wherein a Sn layer having a thickness of 0.2 to 3.0 μm is formed on a surface of the copper foil on which the resin layer is not laminated, and further wherein the 180° peeling strength is measured by conducting a 180° peel test as the surface of the copper foil in a composite test specimen is fixed on a SUS plate and the resin layer is peeled in a direction at an angle of 180° in accordance with JIS-C5016.

2. The copper foil composite according to claim 1 , wherein the equations 1 and 2 are true at the temperature lower than the glass transition temperature of the resin layer.

3. The copper foil composite according to claim 2 , wherein a ratio I/L of fracture strain I of the copper foil composite to fracture strain L of the resin layer alone is 0.7 to 1.

4. The copper foil composite according to claim 2 , wherein a Ni layer or a Cu layer is formed between the Sn layer and the copper foil, or a Ni layer and a Cu layer are formed between the Sn layer and the copper foil in the order of the Ni layer and the Cu layer from the copper foil, and wherein the Ni layer and the Cu layer each have a thickness of 0.1 to 2.0 μm.

5. The copper coil composite according to claim 2 , wherein a Ni alloy layer or a Cu layer is formed between the Sn layer and the copper foil, or a Ni alloy layer and a Cu layer are formed between the Sn layer and the copper foil in the order of the Ni alloy layer and the Cu layer from the copper foil, and wherein the Ni alloy layer and the Cu layer each have a thickness of 0.1 to 2.0 μm.

6. A formed product obtained by working the copper foil composite according to claim 2 .

7. A method of producing a formed product comprising working the copper foil composite according to claim 2 .

8. The copper foil composite according to claim 1 , wherein a ratio I/L of fracture strain I of the copper foil composite to fracture strain L of the resin layer alone is 0.7 to 1.

9. The copper foil composite according to claim 8 , wherein a Ni layer or a Cu layer is formed between the Sn layer and the copper foil, or a Ni layer and a Cu layer are formed between the Sn layer and the copper foil in the order of the Ni layer and the Cu layer from the copper foil, and wherein the Ni layer and the Cu layer each have a thickness of 0.1 to 2.0 μm.

10. The copper coil composite according to claim 8 , wherein a Ni alloy layer or a Cu layer is formed between the Sn layer and the copper foil, or a Ni alloy layer and a Cu layer are formed between the Sn layer and the copper foil in the order of the Ni alloy layer and the Cu layer from the copper foil, and wherein the Ni alloy layer and the Cu layer each have a thickness of 0.1 to 2.0 μm.

11. A formed product obtained by working the copper foil composite according to claim 8 .

12. A method of producing a formed product comprising working the copper foil composite according to claim 8 .

13. The copper foil composite according to claim 1 , wherein a Ni layer or a Cu layer is formed between the Sn layer and the copper foil, or a Ni layer and a Cu layer are formed between the Sn layer and the copper foil in the order of the Ni layer and the Cu layer from the copper foil, and wherein the Ni layer and the Cu layer each have a thickness of 0.1 to 2.0 μm.

14. A formed product obtained by working the copper foil composite according to claim 13 .

15. A method of producing a formed product comprising working the copper foil composite according to claim 13 .

16. The copper coil composite according to claim 1 , wherein a Ni alloy layer or a Cu layer is formed between the Sn layer and the copper foil, or a Ni alloy layer and a Cu layer are formed between the Sn layer and the copper foil in the order of the Ni alloy layer and the Cu layer from the copper foil, and wherein the Ni alloy layer and the Cu layer each have a thickness of 0.1 to 2.0 μm.

17. A formed product obtained by working the copper foil composite according to claim 16 .

18. A method of producing a formed product comprising working the copper foil composite according to claim 16 .

19. A formed product obtained by working the copper foil composite according to claim 1 .

20. A method of producing a formed product comprising working the copper foil composite according to claim 1 .

Assignees

• Tanaka Koichiro
• Kammuri Kazuki
• Jx Nippon Mining & Metals Corp

Inventors

• Tanaka Koichiro
• Kammuri Kazuki

Classifications

• C25D3/30

  of tin · CPC title

• B32B2250/02

  2 layers · CPC title

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• C25D5/12

  at least one layer being of nickel or chromium · CPC title

• Y10T428/12229

  Intermediate article [e.g., blank, etc.] · CPC title